This is a hands-on Summer 2027 internship supporting the Engineering department in implementing and improving the design of advanced equipment used in semiconductor manufacturing facilities. The intern will assist with equipment design, testing, and rework, and will complete a project intended to deliver value to the business. Interns are expected to apply Lean principles and continuous-improvement thinking; training and resources will be provided. The program aims to provide meaningful practical experience that contributes to business objectives and supports professional development. The internship runs from May 17 through August 20, 2027, in Albany, New York. It is payrolled through a payroll process provider.
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Career Level
Intern