Director Silicon Design Engineering

Advanced Micro Devices, Inc•San Jose, CA

20h•Hybrid

About The Position

At AMD, our mission is to build great products that accelerate next-generation computing experiences—from AI and data centers, to PCs, gaming and embedded systems. Grounded in a culture of innovation and collaboration, we believe real progress comes from bold ideas, human ingenuity and a shared passion to create something extraordinary. When you join AMD, you’ll discover the real differentiator is our culture. We push the limits of innovation to solve the world’s most important challenges—striving for execution excellence, while being direct, humble, collaborative, and inclusive of diverse perspectives. Join us as we shape the future of AI and beyond. Together, we advance your career. As ASIC Director – Chip Lead in our Product Development team, you will be responsible for providing technical leadership to one or more Adaptive & Embedded Computing Group (AECG) device programs. You will have sign-off responsibility for the technical execution of device programs from conception & planning to release to manufacturing. Your leadership responsibilities will focus on problem solving in all aspects of the device development cycle including architecture, RTL, analog & custom design, design for test & manufacturing, verification, physical design & timing closure, physical verification, tapeout and post-silicon validation & qualification. When a problem does not clearly fall under the banner of one technical team or another it becomes the responsibility of the Chip Lead to bring expertise, experience and diplomacy together to coordinate a solution.

Requirements

15+ years of experience in ASIC Development Lifecycle.
5+ years of experience in a leadership role with a semiconductor company.
Master’s or PhD in Electrical Engineering, Computer Engineering, or related technical field.
Strong understanding of semiconductor industry and products.

Nice To Haves

FPGA technical experience is a huge plus.
Post-silicon validation experience is a strong asset.
Experience working with Product Planning and Marketing teams is preferred.

Responsibilities

Provide technical leadership to one or more Adaptive & Embedded Computing Group (AECG) device programs.
Have sign-off responsibility for the technical execution of device programs from conception & planning to release to manufacturing.
Focus on problem solving in all aspects of the device development cycle including architecture, RTL, analog & custom design, design for test & manufacturing, verification, physical design & timing closure, physical verification, tapeout and post-silicon validation & qualification.
Coordinate solutions for problems that do not clearly fall under one technical team.
Identify critical tradeoffs and architectural decisions.
Advise on feasibility including early estimates of Schedule, Cost, Size, Power, Floorplan, and identify key implementation decisions.
Serve as Engineering’s interface to Technical Marketing; ensuring the product meets customer needs and supports the required functions and usage modes.
Define/identify new device specific functionality (with Marketing and Architecture).
Negotiate for a new, new version or new variant of an IP (with the IP/COE Lead) when needed.
Be aware of devices and programs throughout the organization; foster engineering re-use.
Help resolve issues and guide trade-offs that arise during any phase of the program but especially in Physical Design.
Engage and resolve problems when some aspect of the program is not meeting its planned objectives.
Communicate changes and their consequences to all stakeholders when engineering or marketing initiates a change to the program.