Director, Heterogenous Integration/Advance Packaging
About The Position
The successful candidate will be in Santa Clara, CA as a member of a global diverse cross functional team responsible for developing new modules in Advanced Semiconductor Packaging. Key Attributes: Domain expertise in advanced packaging areas such as W2W/D2W bonding, micro bumps, TSV, thermal management, optics and multi-wafer stacking with deep understanding of materials, process, device physics and integration. Ability to drive new materials and process development to enable new inflections in logic, DRAM and NAND through structured problem-solving methodology. Proven track record of solving complex problems through innovation and ideation of novel approaches. Ability to define and develop differentiated modules by leveraging Applied’s broad portfolio of tools. Thought leader to define and maintain Applied’s roadmap in hybrid and fusion bonding for emerging device architectures
Requirements
- Minimum of BS/MS in Electrical, Mechanical Engineering, Material Engineering or equivalent
- 5 years of experience in advanced packaging specializing in logic, DRAM or NAND
- Strong communication skills to be effective in dealing with business units, cross-functional teams, internal or external customers
- Lead projects across organization and culture in a fast-paced environment
- Self-starter, team player and able to work independently with minimal supervision
Nice To Haves
- Experience with MES systems for Si fab processing is a plus.
Responsibilities
- Drive new materials and process development to enable new inflections in logic, DRAM and NAND through structured problem-solving methodology.
- Define and develop differentiated modules by leveraging Applied’s broad portfolio of tools.
- Maintain Applied’s roadmap in hybrid and fusion bonding for emerging device architectures
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What This Job Offers
Job Type
Full-time
Career Level
Director
