Director, Heterogenous Integration/Advance Packaging

Applied Materials • Santa Clara, CA

7d • $180,000 - $247,500

About The Position

The successful candidate will be in Santa Clara, CA as a member of a global diverse cross functional team responsible for developing new modules in Advanced Semiconductor Packaging.

Requirements

• Domain expertise in advanced packaging areas such as W2W/D2W bonding, micro bumps, TSV, thermal management, optics and multi-wafer stacking with deep understanding of materials, process, device physics and integration.
• Ability to drive new materials and process development to enable new inflections in logic, DRAM and NAND through structured problem-solving methodology.
• Proven track record of solving complex problems through innovation and ideation of novel approaches.
• Ability to define and develop differentiated modules by leveraging Applied’s broad portfolio of tools.
• Thought leader to define and maintain Applied’s roadmap in hybrid and fusion bonding for emerging device architectures
• Minimum of BS/MS in Electrical, Mechanical Engineering, Material Engineering or equivalent
• 5 years of experience in advanced packaging specializing in logic, DRAM or NAND
• Strong communication skills to be effective in dealing with business units, cross-functional teams, internal or external customers
• Lead projects across organization and culture in a fast-paced environment
• Self-starter, team player and able to work independently with minimal supervision

Nice To Haves

• Experience with MES systems for Si fab processing is a plus.

What This Job Offers

• Job Type: Full-time
• Career Level: Director