Director – Advanced Packaging (Panel-Scale Technologies)

Advanced Micro Devices, Inc•Austin, TX

12d

About The Position

AMD is seeking an advanced packaging technology leader to drive panel-scale packaging technology for next-generation data center and AI accelerator products. As a fabless company, AMD delivers packaging innovation through ecosystem partners. The Director will set the panel-scale technology direction and work with foundry, OSAT, substrate, materials, and equipment partners to define and deliver the materials, processes, design rules, and Design for Manufacturing (DFM) and Design for Yield (DFY) guidelines required for AMD products. The role owns panel-scale technology readiness from concept through qualification and high-volume manufacturing. It aligns partner roadmaps with AMD needs, holds partners accountable for technical and schedule commitments, and leads cross-functional AMD teams across geographies. The Director communicates progress and risks to executive leadership and drives joint resolution of yield, reliability, and manufacturability challenges.

Requirements

BS, MS, PhD, or equivalent in Materials Science, Mechanical Engineering, Electrical Engineering, Chemical Engineering, Applied Physics, or Applied Mathematics.
Semiconductor technology development experience.
Experience leading technology development through foundries, OSATs, substrate suppliers, materials suppliers, and equipment vendors.
Deep knowledge of 2.5D and 3D packaging, with experience in panel-level packaging or large-format substrates.
Experience with wafer-level assembly processes such as fan-out, RDL fabrication, bumping, chip-on-wafer assembly, molding, temporary bonding/debonding, and wafer thinning.
Experience with die bonding technologies, including mass reflow, thermocompression bonding (TCB), and hybrid bonding.
Breadth of experience addressing thermo-mechanical, power delivery, and signal integrity challenges in large, high-power data center packages.
Proven track record of qualifying new packaging technologies with partners for advanced data center products and ramping them to high-volume manufacturing.
Leadership experience driving cross-functional teams and influencing external partners without direct authority.
This role is not eligible for visa sponsorship.

Nice To Haves

Familiarity with emerging panel technologies such as glass-core substrates and panel-level RDL and interposers.

Responsibilities

Define the panel-scale packaging technology roadmap for data center and AI products and align partner technology roadmaps to it.
Lead panel-scale technology development with partners, including panel-level fan-out, large-format RDL and interposers, and panel-scale die bonding, from concept through full qualification.
Set technical requirements and guide partners in materials selection and process definition to meet AMD performance, reliability, and cost targets.
Work with partners to establish design rules and DFM/DFY guidelines, using jointly defined test vehicles to validate capability.
Drive partner equipment and infrastructure readiness for panel-format manufacturing.
Engage partners to resolve large-panel challenges, including warpage, dimensional stability, overlay and alignment, and large-area uniformity.
Establish yield and reliability targets, monitor partner data, and drive joint improvement plans through high-volume ramp.
Lead cross-functional AMD teams across geographies and provide executive-level updates on partner progress, risks, and decisions.