Diffusion Engineering Manager Job# 4960

TSMCPhoenix, AZ
Onsite

About The Position

A job at TSMC Arizona offers an opportunity to work at the most advanced semiconductor fab in the United States. TSMC Arizona’s first fab will operate its leading-edge semiconductor process technology (N4 process), starting production in the first half of 2025. The second fab will utilize its leading edge N3 and N2 process technology and be operational in 2028. The recently announced third fab will manufacture chips using 2nm or even more advanced process technology, with production starting by the end of the decade. America’s leading technology companies are ready to rely on TSMC Arizona for the next generations of chips that will power the digital future. As a Diffusion Engineering Manager, you will demonstrate a strong sense of reliability and enthusiasm and will possess an attitude that embodies our core values – Integrity, Commitment, Innovation, and Customer Trust. Multiple positions available. This role involves directing engineering and manufacturing operations within the Diffusion department, providing managerial oversight to ensure process excellence and production efficiency. You will manage and supervise improvements in module processes and equipment, leading initiatives to enhance wafer quality and productivity, and coordinating with Process Integration, Manufacturing, Yield Improvement, and Cross-Module teams to sustain high-quality output.

Requirements

  • Master’s degree or foreign equivalent in Electronics Engineering, Electrical Engineering, Mechanical Engineering, Material Science, Chemical Engineering, Automation Engineering or a related field and 3 years of experience in an engineering role.
  • Alternatively, a Bachelor’s degree or foreign equivalent in Electronics Engineering, Electrical Engineering, Mechanical Engineering, Material Science, Chemical Engineering, Automation Engineering or a related field, plus 5 years of progressive, post-baccalaureate experience in an engineering role.
  • 3 years of experience with semiconductor manufacturing principles, practices, and techniques as they relate to equipment engineering and maintenance.
  • 3 years of experience with 300mm vertical diffusion furnace semiconductor processing equipment, including TEL INDY Plus or KE Quixace.
  • 3 years of experience with plasma techniques for ALD SiN film applications.
  • 3 years of experience with batch-type furnace processes for depositing Atomic Layer Deposition (ALD) and Chemical Vapor Deposition (CVD) films.
  • 3 years of experience with development and implementation of innovative methods for improving film properties or defect performance on batch-type furnace equipment.
  • 3 years of experience overseeing junior engineers.

Responsibilities

  • Recruit, mentor, and develop engineering staff through structured career development plans, aligning departmental goals with organizational objectives.
  • Set departmental priorities, allocating resources, and evaluating performance metrics to ensure operational targets are met.
  • Establish policies and procedures that promote efficiency, safety, and compliance.

Benefits

  • Medical plan offerings
  • Dental plan offerings
  • Vision plan offerings
  • Income-protection programs
  • 401(k)-retirement savings plan
  • Competitive paid time-off programs
  • Paid holidays
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