Dicing Process Operator

Vishay•Fremont, CA

39d•Onsite

About The Position

Vishay Applied Thin Film Products is seeking a Dicing Process Operator in Fremont, CA. This role involves reading and interpreting blueprints and customer specifications, testing and preparing substrates for dicing, performing calculations to instruct cutting machines, cleaning circuits, and packaging them for shipment. The operator will also perform heat treatment, probing, and data entry into the Vantage system. This position requires adherence to safety regulations and participation in team problem-solving.

Requirements

High school diploma or equivalent.
Proficient in English. Must have good English communication skills, both for written and verbal communication.
Ability to read and follow prints and procedures.
Ability to read and understand written and oral instructions.
Good manual dexterity.
Good teamwork is essential.
Ability to participate in team problem-solving activities.
Strong interpersonal skills and team orientation, with the ability to work effectively with a wide range of people.
Must be a "U.S. Person" as defined by 22 C.F.R. §120.15 (U.S. Citizen, lawful permanent resident, refugee, or asylee).

Nice To Haves

Knowledge to safe chemical handling practices desired.
Prior experience working for ISO 9000 certified company.

Responsibilities

Read and interpret blueprints and customer specifications.
Test substrates to meet specifications, utilizing tools; prepares substrates for dicing function by mounting onto small glass plates; perform calculations to instruct cutting machines to dice 4” squares into circuits; use tweezers, chemicals and/or distilled water to remove post-dicing residue; use tweezers to prepare circuits to be shipped.
Heat/treat/and/or 100% probe; read work orders and study assembly drawings to determine heat treat operation to be performed. Adjust heat treat machine/hot plate controls according to work specifications. Examine and test substrate at various stages of production, according to standard procedures, to detect non-standard or defective circuits. Maintain records of probe results per resistor. Enter production information into computer via Vantage system.
Dicing: placing of wax-mounted substrates on glass into vacuum chucks in work area of dicing saws for the cutting of the substrates into circuits. Must be able to read blueprints and interpret drawings, follow customer specifications, direct saws to cut to specifications. Enter production information into computer via Vantage system.
Cleaning: after dicing, manual cleaning of circuits in various chemicals and/or distilled water, for a specified period of time. Prepare circuits for packaging. Enter production information into computer via Vantage system.
Via enhancement: manually adjust circuit surface to work order specifications. Enter production information into computer via Vantage system.
Circuit packaging: utilize tweezers to move circuits from 6” petri dish to waffle packs, ready for quality assurance inspection and shipment. Works is often performed under microscope. Enter accurate production information into computer via Vantage software.
Perform data entry into manufacturing software.
Comply with safety regulations.
Participate in team problem-solving.
May be required to perform other duties.