Device Engineer

onsemi•Gresham, OR

About The Position

onsemi is seeking a Device Engineer to join its Device Engineering / Yield Enhancement group in Gresham, Oregon. The role works with engineers and technicians in a fast-paced silicon wafer fabrication production and technology-development environment. The technologies range from sub-0.18um to 0.5um nodes. The group focuses on wafer- and die-level yield enhancement, technology transfers, new product introduction, and production sustaining and optimization. The position applies semiconductor device knowledge across the silicon manufacturing chain, from bare wafers to finished goods, with a significant focus on fab manufacturability. It regularly communicates with Fab Process Engineering, Technology Development, Failure Analysis, Design/Layout, wafer probe/test, in-line defect control, Quality, and Business Unit part owners and managers.

Requirements

  • BS/MS or equivalent in Engineering; BSEE/MSEE preferred. Physics, Chemistry, Chemical Engineering, Materials Engineering, or a related technical field will also be considered.
  • Broad understanding of semiconductor devices such as CMOS, DMOS, and Bipolars.
  • At least 5 years of experience in semiconductor process technology and wafer fabrication.
  • Problem-solving mindset.
  • Comfort using data analysis and statistics to reach conclusions.
  • Concise and clear written and oral communication skills.
  • Strong interpersonal skills.

Nice To Haves

  • Experience in one or more of Process/Device Integration, Circuit Design/Simulation, Test (parametric or circuit), or Process Engineering.
  • Experience with DOE and experiment analysis.
  • 10 or more years of experience in semiconductor process technology and wafer fabrication.
  • Ability to relate product circuit performance to semiconductor device parameters.
  • Knowledge of post-fab product manufacturing, such as assembly and test.
  • Ability to debug issues at any point in a product manufacturing sequence.
  • Hands-on knowledge of GDS layout viewing and editing.

Responsibilities

  • Enhance yield for production products.
  • Introduce new products into the Fab.
  • Reduce and prevent scrap.
  • Improve processes using existing and newly acquired process equipment, often working directly with Process Engineering, to minimize lot-to-lot, wafer-to-wafer, and product-to-product variation; lower cost; improve throughput; reduce defectivity; and establish standardization and Best Known Methods.
  • Analyze manufacturing and test data to improve product performance.
  • Ensure all shipped material meets requirements.
  • Present trends, KPIs, and process improvements to the management team.
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