Dir II- Eng

BAE Systems • Nashua, NH

1d • Onsite

About The Position

BAE Systems is seeking a Deputy Director to lead microelectronics engineering and foundry operations for a high-visibility portfolio. You will steer strategy, execution, and continuous improvement across design, fabrication, packaging, and production for programs totaling $100M+ annually.

Requirements

• Proven Leadership: A demonstrated track record of successfully operating and managing advanced semiconductor chip manufacturing facilities in a production environment.
• Technical Expertise: Deep understanding of advanced process technologies, particularly within GaAs/GaN fabrication.
• Strategic Thinking: Ability to synthesize complex information, develop forward-looking roadmaps, and translate strategy into actionable plans.
• Problem-Solving Skills: Ability to analyze complex challenges, develop creative solutions, and implement effective strategies.
• Strong Communication Skills: Ability to effectively communicate with both technical and non-technical audiences, including senior leadership.
• Results-Oriented: A proven ability to deliver results in a fast-paced, demanding environment.
• Growth Mindset: A commitment to continuous learning, embracing new technologies, and fostering a culture of innovation within the team.
• Bachelor’s degree in Electrical Engineering, Materials Science, Physics, or related field
• 15+ years in microelectronics with 10+ years leading wafer fab and packaging operations.
• U.S. citizenship with eligibility to obtain a Secret security clearance.
• Proven experience leading large organizations of engineers, technicians, and program staff.
• Demonstrated success planning, managing, and executing complex projects.
• Exceptional communication, collaboration, and stakeholder management skills.
• Passion for mentoring mid‑ to late‑career team members; proven talent development results.

Nice To Haves

• Director‑level leadership in microelectronics (commercial or defense), especially in III–V technologies (GaAs/GaN), RF/MMIC, advanced packaging, and high‑reliability manufacturing.

Responsibilities

• Lead & Grow a High-Performing Team: Direct and mentor a team of skilled engineers and manufacturing professionals operating our 6-inch (150mm) wafer fabrication facility. Focus on creating a safe, high-quality environment where innovation thrives.
• Drive Innovation from Design to Production: Lead the full lifecycle of microelectronics component development - from initial design and fabrication through packaging and into large-scale production for both development and deployed programs.
• Be a Strategic Partner: Collaborate closely with Business Area leadership, providing critical insights and ensuring projects stay on schedule, within budget, and meet stringent performance requirements.
• Chart the Course for Future Success: Develop and champion a sector-level microelectronics capability roadmap, leveraging both internal expertise and insights from external leaders in the field.
• Ensure Operational Excellence: Establish and maintain best-in-class operating policies and procedures, aligned with company standards and regulatory compliance.
• Manage & Optimize: Drive budget and resource planning, setting key performance indicators (KPIs) for financial performance, staffing, yield, quality, and delivery. Identify and implement improvements to optimize operations, reduce costs, and accelerate production timelines.

Benefits

• health, dental, and vision insurance
• health savings accounts
• a 401(k) savings plan
• disability coverage
• life and accident insurance
• employee assistance program
• legal plan
• discounts on things like home, auto, and pet insurance
• paid time off
• paid holidays
• paid parental leave
• military leave
• bereavement leave
• any applicable federal and state sick leave
• company recognition program to receive monetary or non-monetary recognition awards

What This Job Offers

• Job Type: Full-time
• Career Level: Director