About The Position

The position is on Apple’s innovative Datacenter MLB Reliability Engineering team, wherein we are seeking a highly analytical individual to develop the reliability strategy for our next-generation Data Center motherboards. In this role, you will bridge the gap between component-level and package level physics of failures and system-level availability. You will drive SoC and board integration reliability through rigorous stress testing and physics-of-failure analysis, utilizing advanced statistical modeling to ensure these critical modules meet the uptime and availability requirements of a high-demand data center environment.

Requirements

  • BS in Materials Science, Electrical, Mechanical Engineering or an equivalent field desired.
  • 5+ years of experience.
  • Proficiency in statistical life data analysis.
  • Strong knowledge of Semiconductor package integration, SLI reliability, passive components, PCB reliability, bonding materials, and warpage control.
  • Ability to apply FMEA (Failure Modes and Effects Analysis) methodologies.
  • Excellent written and verbal communication skills with the ability to explain complex statistical concepts to non-experts.
  • Ability to manage multiple projects simultaneously in a fast-paced environment.

Nice To Haves

  • MS or PhD in Reliability Engineering, Systems Engineering, Electrical Engineering, Materials Science, or an equivalent field.
  • Background in reliability for large-die packages, heterogeneous integration, and high-power server motherboards.
  • Experience applying reliability modeling (Markov, RBD, Bayesian) and RAS metrics to Data Center architectures.
  • Proficiency with reliability software (e.g., Weibull++, BlockSim, JMP, Minitab) and scripting languages for statistical modeling like Python, R, or MATLAB.
  • A record of initiating innovation and continuous improvement in reliability methodologies.
  • Dynamic and "can-do" attitude with a desire to work with a great team and product.
  • Exceptional problem-solving abilities and strong attention to detail.

Responsibilities

  • Develop the reliability strategy for next-generation Data Center motherboards.
  • Bridge the gap between component-level and package level physics of failures and system-level availability.
  • Drive SoC and board integration reliability through rigorous stress testing and physics-of-failure analysis.
  • Utilize advanced statistical modeling to ensure critical modules meet uptime and availability requirements.
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