CVD Process Engineer

MACOM Technology Solutions Holdings, Inc.•Durham, NC

1d•Onsite

About The Position

In this critical role you will be responsible for the CVD, Diffusion, and Implant processes within MACOM’s internal semiconductor fab. The product portfolio includes GaN, GaAs, Si, and InP based technologies. Responsibilities include development, continuous improvement, and sustaining processes all in close partnership with Device and Integration Engineering as well as Business Unit design teams. You will be expected to define and set deliverables, plan resources, and achieve desired results. Excellent judgment, expertise in semiconductor processing, and an optimistic, can-do approach are essential to success in this role. The position reports to the Director of Engineering. As a member of the process engineering team, the Thin Film Process Engineer will be responsible for sustaining existing and Diodes and developing new processes in the area of CVD/PVD, ALD Deposition in the MACOM wafer fab located in RTP, NC.

Requirements

Solid hands‑on experience with thin film deposition processing in a semiconductor manufacturing environment
Working knowledge of CVD/PVD, ALD thin film deposition tools, including process objectives, hardware fundamentals, and typical failure modes.
Familiarity with process control concepts and statistical analysis
Ability to interpret and act on process and tool data to resolve yield, defect, or performance issues
Effective communication skills, both written and verbal.
Willingness to work in a cleanroom environment.
Ability to work constructively with a cross-functional Team of Fab Operations, Quality, Facilities, Equipment Engineering and Technicians.
BS or MS degree in Engineering or Physics with at least 5 years of CVD experience.
Demonstrated knowledge in compound semiconductor processes for high frequency applications.
Familiarity with typical materials systems for compound semiconductor.
Strong understanding of semiconductor device physics and IC processing, data mining and statistics, SPC, DOE, Lean manufacturing, Six Sigma, and structured problem solving.
Must have a proven track record of solving technical problems, project ownership, meeting deadlines, and multitasking.
Must display a strong sense of ownership, drive and dedication to continuous improvement.
Must display an enthusiastic boldness for taking on aggressive goals and a commitment to achieving them.
Must possess the ability to work collaboratively with cross functional teams to improve processes.
Excellent verbal/written communication skills, including technical writing for summarizing data and findings, writing process and equipment specifications and work instructions.
Detail-oriented with strong organizational skills.
Due to ITAR restrictions, must be US citizen or Permanent Resident.

Nice To Haves

Familiarity with semiconductor process integration requirements, including interactions with lithography, deposition, dry etch and clean steps
Experience with Statistical Process Control (SPC) tools and methodologies (e.g., control charts, Cp/Cpk analysis, DOE).
Basic coding or scripting skills (e.g., Python, MATLAB, or R) to support data analysis and SPC automation.
Familiarity with data visualization tools (e.g., JMP, Tableau, or Power BI).
Understanding of Design of Experiments (DOE) and root cause analysis techniques (e.g., 5 Whys, Fishbone diagrams).
Exposure to Six Sigma or Lean Manufacturing principles.

Responsibilities

Development, continuous improvement, and sustaining processes in CVD, Diffusion, and Implant.
Define and set deliverables, plan resources, and achieve desired results.
Sustain existing and develop new processes in the area of CVD/PVD, ALD Deposition.
Improve Automation, Data collection, and Mean Time to Detect (MTTD) to set up Product and Process checks.
Provide guidance to non-exempt and exempt personnel.