CPU Full Chip Physical Integration Engineer

AppleAustin, TX
Onsite

About The Position

At Apple, new ideas quickly become extraordinary products, services, and customer experiences. The company seeks passionate and dedicated individuals to contribute to groundbreaking Apple products. This highly visible role is central to a processor design effort, requiring interface with all disciplines and having a critical impact on delivering functional products to millions of customers quickly. The position involves participating in the physical design, integration, and verification of high-performance, low-power processor development.

Requirements

  • Minimum BS and 10+ years of relevant industry experience
  • Experience with scripting in Perl or TCL

Nice To Haves

  • Knowledge of industrial standards and practices in Physical Design, including Floorplanning, Partitioning, Budgeting, Place and Route and Physical Verification
  • Experience in developing and implementing Power Grid and Clock specifications
  • Solid knowledge of Low Power Design, Physical Construction, Integration, EMIR (Drop/Noise), SIGEM Analysis, Formal Verification, Physical PDV, DRC/LVS Verification, and DFM
  • Solid understanding of verification tools such as Conformal LP, LEC, RedHawk, Calibre
  • Solid understanding of CMOS circuit design. Layout design background is a plus
  • Working knowledge of Extraction and STA methodology and tools
  • Working knowledge of Computer Architecture
  • Ability to work well in a team, being an excellent problem solver, and self motivated

Responsibilities

  • Full chip floorplan, area optimizations, block partitioning and pin placements
  • Own chip level place and route (PnR), final CPU layout database construction and verification (PDV)
  • Develop and validate Power Grid, including routability analysis
  • Drive custom layout integration, block and full-chip level EM/IR, electrical verification/analysis as well as formal verification
  • Work with the implementation/CAD teams during the entire chip design cycle to drive signoff closure for tapeout
  • Work with the SOC team to meet IP technical and delivery requirements
  • Participate in establishing CAD and physical design methodologies and flow development for chip integration and analysis
  • Scripting to automate tasks and improve debug efficiency
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