Computer Engineer Development of RF and Digital Systems

MIT Lincoln Laboratory•Lexington, MA

5d•$100,200 - $150,000•Onsite

About The Position

MIT Lincoln Laboratory’s Advanced Technology Division develops advanced materials, devices, and subsystems that have broad impact on U.S. Government, industry, and academia. The Division has made a wide range of important contributions during the Laboratory’s 70+ year history, including development of bulk and epitaxial crystal growth, charge-coupled device (CCD) imagers, 193-nm lithography, fully depleted silicon-on-insulator (FDSOI) CMOS electronics, semiconductor diode lasers and amplifiers, superconducting electronics and quantum bit (qubit) devices, and photonic integrated circuits (PICs). To enable this advanced technology development, the Laboratory has implemented vertically integrated in-house resources to facilitate design, lithographic mask layout, material growth and characterization, fabrication (e.g., silicon, compound-semiconductor, wafer bonding, flip-chip hybrid), packaging, and testing of electronic and photonic circuits. These in-house resources are used to fabricate a variety of devices and circuits including lasers, waveguide photodetectors, optical modulators, and CMOS and cryogenic electronics with applications in quantum computing, atomic systems, advanced laser sources, microwave photonics, communications, sensing, and other areas of interest to the U.S. Government, industry, and academia. Fabrication resources include: Microelectronics Laboratory (ML): Cleanroom housing a silicon-fabrication toolset operating on 200-mm-diameter wafers at a 90-nm lithography node, which represents the most advanced silicon fab in the U.S. Government lab system. Compound Semiconductor Laboratory (CSL): Facilities housing III-V and non-silicon material growth (molecular beam epitaxy (MBE), metalorganic chemical vapor deposition (MOCVD), diamond chemical vapor deposition (CVD)) and fabrication. Microsystems Integration Facility (MIF): Packaging and integration facilities for wire-bonding, vacuum-reflow soldering, flip-chip hybrid integration. The Integrated RF and Photonics Technology Group is currently seeking a full-time Computer Engineer to aid in the development of next generation RF and digital systems. The position includes opportunities to take part in the design and prototyping of complex RF systems, with primary focus on digital (FPGA/DSP/microcontroller-based) circuits, networking, firmware and software. This involves working in a team of electrical and mechanical engineers. The position will include both architecture and concept development, experimental prototyping, and demonstrating results for advanced RF prototypes. An ideal candidate will be able to work independently in these areas and perform as part of a small team of developers in larger system designs.

Requirements

A Bachelor of Science degree in Computer Science, Electrical or Computer Engineering, Applied Mathematics, or related technical degree with demonstrable knowledge of embedded signal processing hardware is preferred.
Experience developing synthesizable VHDL, Verilog, and/or SystemVerilog.
Experience implementing FPGA designs in hardware.
Experience testing and debugging firmware designs in both simulation and in hardware.

Nice To Haves

Experience implementing and integrating with digital interfaces, such as SPI, PCIe and Gigabit Ethernet.
Experience developing software for real-time distributed systems.
Good working knowledge of the operation of laboratory test equipment and RF hardware including but not limited to network analyzers, spectrum analyzers, oscilloscopes, power meters, software defined radios, etc.
Experience in C++ and Java within a real-time Linux processing environment.
Proficiency in MatLab, C/C++, Python or other scientific programming languages.
Excellent communication skills and understanding of embedded processing concepts needed to communicate with staff regarding the use of industry best practices for development and documentation.

Responsibilities

Design and prototyping of complex RF systems, with primary focus on digital (FPGA/DSP/microcontroller-based) circuits, networking, firmware and software.
Architecture and concept development.
Experimental prototyping.
Demonstrating results for advanced RF prototypes.
Working independently in development areas.
Performing as part of a small team of developers in larger system designs.