Chip Engineering Lead / Manager

Ciena•Ottawa, ON

53d

About The Position

We’re looking for a dynamic engineering leader to guide our Chip Engineering team within the Photonic Integrated Circuit (PIC) organization. This role is ideal for a seasoned product engineer ready to step into leadership, or an established manager seeking a new experience in a cutting-edge photonics environment. The position blends hands‑on technical work with team leadership and strategic decision‑making, and we will tailor responsibilities to the strengths of the successful candidate. You’ll join a collaborative, tightly knit group focused on developing and scaling advanced photonic chip technologies. Our team supports a vertically integrated internal customer base and plays a central role in new product introduction, reliability engineering, and continuous improvement. While our core expertise is indium phosphide (InP) photonics for coherent communications, we are actively expanding into new material systems and integration platforms.

Requirements

Strong analytical skills, including data mining, normalization, and statistical analysis for manufacturing environments.
Deep understanding of chip‑level reliability principles and relevant industry standards.
Proficiency with project and product management tools such as Agile workflows, Gantt charts, yield Paretos, and correlation analysis.
Knowledge of foundry and backend processes, ideally in InP photonics and/or silicon or silicon nitride photonics.
Ability and willingness to travel internationally (including Asia) for 1–2 weeks at a time, up to four times per year.
Bachelor’s degree in engineering or a related scientific field required; graduate degree preferred.
At least 10 years of industry experience in product engineering, quality, and reliability for photonic chip technologies.

Responsibilities

Lead, mentor, develop and potentially expand a four‑person team (including yourself) responsible for R&D product engineering and reliability.
Manage relationships with external supply partners, including statements of work, budgeting, planning, and material logistics.
Drive yield improvement and cost reduction from received die through finished die on sub-mount, across both production and new product introduction.
Establish and maintain factory work instructions; support process transfer from R&D to production; ensure Agile documentation and ISO compliance.
Oversee foundry process variations, up‑revisions, and change management activities.
Apply knowledge of InP foundry processes—such as wafer thinning, cleaving, facet coating, and automated visual inspection—to guide development and troubleshooting.
Provide first‑line technical support for issues arising at external manufacturing partners, engaging internal experts when needed.
Support project management activities depending on organizational priorities.
Collaborate closely with chip designers, hardware and product engineers, and commercial supply chain teams to ensure smooth product lifecycle execution.