Chemical Mechanical Planarization (CMP) Process Engineer

Broadcom•Fort Collins, CO

1d•$91,100 - $146,000•Onsite

About The Position

The Wireless Semiconductor Division (WSD) designs and develops highly integrated, state-of-the-art RF front-end solutions for use in mobile communications and WiFi access points. Together, we’re enabling our customers to distinguish their products using Broadcom’s differentiated RF semiconductors. As a CMP Process Engineer in the Finish Team, you will be responsible for developing, optimizing, and ensuring the quality of CMP processes within the wafer fabrication facility located in Fort Collins, Colorado. You will work closely with Equipment Engineers, Industrial Engineering, R&D, and external Vendors to meet the needs of high volume manufacturing and technology development with process capability.

Requirements

B.S. in Chemical Engineering, Mechanical Engineering, or related field.
5 years of experience working in semiconductor manufacturing, CMP experience preferred.
Experience maintaining an established process, monitoring inline data, and responding proactively to issues affecting Yield and/or Quality.
Excellent teamwork and good verbal and written communication skills. Demonstrated strong partnership skills with teams like Operations and Process Technician organizations.
Good problem solving skills, sound analytical techniques, and an ability to solve problems systematically. Design of Experiment (DOE), characterization, and optimization capabilities. Strong understanding of SPC and proficiency with data science and SPC software (JMP, Spotfire, SPACE, Excel, etc).
Familiarity applying Lean manufacturing, Six-Sigma, and similar principles to complex issues.
Demonstrates good judgment in selecting methods and techniques for obtaining solutions.
Strong sense of ownership and willingness to work across organizational boundaries to resolve issues.

Nice To Haves

CMP experience preferred.

Responsibilities

Sustain daily CMP operations by monitoring statistical process control (SPC) charts and responding to lot holds, tool issues, and fault detection & classification (FDC) interdiction events.
Investigate and correct manufacturing defects, scrap, and other issues using root-cause analysis within a Plan-Do-Check-Act (PDCA) system.
Develop, characterize, and optimize processes to enable new product introduction (NPI), support new technology from R&D teams, increase wafer yield, and improve device performance.
Work closely with and communicate changes to stakeholders at various levels of the organization, including Operators and Process Technicians.
Qualify new tools and recipes through the design and execution of rigorous process qualification plans while evaluating the impact on cost, throughput, capacity, and other factors.
Collaborate with integration, yield, procurement, and other teams to implement continuous improvement projects within the area of ownership.
Document procedures for Operators and other tool users to enable their operation of the equipment for the desired outcomes.