Associate Packaging Engineer
About The Position
Semtech's Signal Integrity Products (SIP) Business Unit delivers high-performance mixed-signal ICs for data communications and video broadcast industries. Our packaging team plays a critical role in the full IC development lifecycle, working across a highly integrated group of digital, analog, and physical designers, as well as manufacturing, quality, and operations teams worldwide. By joining Semtech, you will contribute to the development and delivery of advanced semiconductor packages that protect and interconnect cutting-edge integrated circuits. Packaging engineers are responsible for designing the case — also known as the "package" — that encapsulates a semiconductor integrated circuit (IC), protecting it against external factors and providing adequate interconnect points to printed circuit boards. This discipline draws on multiple engineering skills including manufacturing, electrical, mechanical, thermal, and reliability engineering. This position targets individuals with electrical engineering expertise and foundational knowledge of component engineering principles, who will contribute to prototype development, qualification activities, and engineering sample delivery across Semtech's global supplier network.
Requirements
- Bachelor's degree in Mechanical or Industrial Engineering, or 5+ years of experience in a relevant electronic manufacturing environment.
- Demonstrated experience or strong aptitude with manufacturing systems such as SAP and Agile.
- Experience with the following packaging technologies: WLCSP, RDL, flip-chip Ball Grid Array (BGA), System in Package (SiP), high-density substrate, and PCB design.
- Experience with EDA design tools such as Cadence Advanced Package Designer v16.6, Artwork Qckvu v3.51, Asitic, and DraftSight is beneficial.
- Understanding of design implications related to JEDEC specification JESD47H (Stress-Test-Driven Qualification of Integrated Circuits) is a definite advantage.
- Strong analytical and problem-solving skills with excellent attention to detail.
- Effective verbal and written communication skills; ability to work cross-functionally in a global team environment.
Nice To Haves
- Master's degree in Mechanical, Electrical, or Industrial Engineering preferred.
- Prior experience in a semiconductor packaging or assembly environment.
Responsibilities
- Manufacturing engineering oversight across multiple worldwide suppliers, covering early prototype product, qualification vehicles, and early engineering samples
- Serve as technical contact point between engineering, operations, and quality teams
- Prepare engineering documentation and customized assembly instructions
- Select and manage raw material inventory
- Establish priorities and track requirements in a highly dynamic environment
- Track quality deviations and drive disposition and resolution
Benefits
- EEO employer M/F/D/V
- Drug-free workplace
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What This Job Offers
Job Type
Full-time
Career Level
Entry Level
