Associate FIB-SEM Engineer

The Mitre Corporation • Albuquerque, NM

10d • $80,400 - $120,600 • Onsite

About The Position

MITRE’s Electronic Systems Security department is hiring an Associate FIB-SEM Engineer to support advanced research and development projects involving microelectronics processing and security. The role joins technical experts and multidisciplinary teams working on embedded security and physical threats to embedded systems. The engineer applies focused ion beam (FIB), plasma focused ion beam (PFIB), and scanning electron microscopy (SEM) expertise to semiconductor processing and analysis in an on-site laboratory environment.

Requirements

• Typically requires less than one year of related experience and a related bachelor’s degree in electrical engineering, mechanical engineering, chemical engineering, materials science, chemistry, physics, or an equivalent combination of related education and work experience.
• Experience with FIB-SEM and/or PFIB-SEM and associated sample preparation.
• Effective oral and written communication skills.
• Ability to work independently and as part of a team.
• Attention to detail.
• Ability to consistently record technical information in notebooks and internal reports.
• Must be eligible to obtain and maintain a Secret U.S. Government-issued security clearance; U.S. citizenship is required for clearance eligibility.
• Must work on-site five days per week.

Nice To Haves

• Master’s degree or PhD in electrical engineering, mechanical engineering, chemical engineering, materials science, chemistry, physics, or a related field.
• Experience with semiconductor reverse engineering and/or failure analysis methods and equipment, such as wet chemistry, vacuum equipment, reactive ion etchers, micro/nanofabrication tools, failure analysis tools, CAD navigation, precision milling and polishing stations, optical microscopy, IR microscopy, and mechanical tools.
• Active security clearance.

Responsibilities

• Participate in teams conducting hands-on security assessments of embedded systems and developing approaches and countermeasures for emerging physical threats.
• Delayer and cross-section chips, prepare TEM lamellae, and perform circuit edits using FIB and PFIB systems.
• Image chips using SEM and optical microscopy.
• Prepare samples for FIB-SEM, including mechanical polishing and sputter coating with thin conductive materials.
• Use advanced navigation to target specific areas on chips according to instructions from the microelectronics analysis team.
• Contribute to a safe laboratory working environment.
• Monitor tool performance and coordinate with tool vendors for preventative maintenance and emergency repairs.
• Contribute to process improvements, documentation, and cross-training.

What This Job Offers

• Job Type: Full-time
• Career Level: Entry Level