Associate, Electrical Engineer

L3Harris Technologies•Clifton, NJ
•$71,000 - $132,000•Onsite

About The Position

This role involves determining design approaches and parameters, performing system analysis to assess design feasibility within time and cost constraints, and utilizing modeling tools to establish operating data, conduct experimental tests, and evaluate results. The engineer will select components and equipment based on specifications and reliability, perform simulations, and present design reviews. Additionally, the role requires writing scripts to control synthesis and build tools. Key responsibilities include designing, analyzing, modifying, testing, and evaluating FPGA and programmable hardware, as well as designing complex Circuit Card Assemblies for Avionics and Space customer's photonic subsystems and integrated communication systems. Specific areas of focus include Digital Design (requiring knowledge of programmable logic, VHDL, and digital communications systems), Modem Design (including SATCOM, wireless, cellular, and software-defined radios, requiring knowledge of digital communications systems, waveform generation, signal processing, FPGA design in VHDL, and familiarity with Digital Signal Processor chips), DSP design (requiring knowledge of digital signal processing techniques, algorithm development, software coding, and simulation/modeling using MATLAB), and Microelectronics Design (requiring training in advanced electronics packaging and MEMS technology). Experience with high-density interconnect and semiconductor packaging technology is desired.

Requirements

  • Pursuing a bachelor's degree in electrical engineering, Electrical Engineering Technology, Computer Science or related field or have completed their bachelor's degree within the last 12 months, regardless of age.
  • Digital Design requires programmable logic, VHDL language and digital communications systems knowledge
  • Modem Design requires knowledge of digital communications systems, waveform generation and signal processing, FPGA design (in VHDL) and familiarity with Digital Signal Processors chips
  • DSP design positions require knowledge of digital signal processing techniques, algorithm development, software coding and simulation/modeling using MATLAB
  • Microelectronics Design requires training in advanced electronics packaging and MEMS technology

Nice To Haves

  • Experience with high density interconnect and semiconductor packaging technology is desired

Responsibilities

  • Determine design approaches and parameters
  • Perform system analysis to determine feasibility of design within time and cost constraints
  • Utilize modeling tools and equipment to establish operating data, conduct experimental tests, and evaluate results
  • Select components and equipment based on analysis of specifications and reliability
  • Perform simulations and present design reviews to peer engineers
  • Write scripts to control synthesis and build tools
  • Design, analyze, modify, test and evaluate FPGA and programmable hardware
  • Design complex Circuit Card Assemblies to support Avionics and Space customer’s photonic subsystems and integrated communication systems
  • Digital Design requires programmable logic, VHDL language and digital communications systems knowledge
  • Modem Design (including SATCOM, wireless, cellular and software defined radios) requires knowledge of digital communications systems, waveform generation and signal processing, FPGA design (in VHDL) and familiarity with Digital Signal Processors chips
  • DSP design positions require knowledge of digital signal processing techniques, algorithm development, software coding and simulation/modeling using MATLAB
  • Microelectronics Design requires training in advanced electronics packaging and MEMS technology

Benefits

  • health and disability insurance
  • 401(k) match
  • flexible spending accounts
  • EAP
  • education assistance
  • parental leave
  • paid time off
  • company-paid holidays
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