Associate Director, Engineering (Microelectronics)

RTX•Concord, MA

1d•Onsite

About The Position

At RTX, the world's largest aerospace and defense company, 185,000 great minds are united by purpose and inspired to make a difference solving the world’s most complex problems. With our three market leading businesses, world-class operations and investments in research and development, we offer capabilities and opportunity no one else can. Together, we push the boundaries of known science and find new ways to connect and protect our world. Raytheon brings the strength of more than 100 years of experience and renowned engineering expertise to meet the needs of today’s mission and stay ahead of tomorrow’s threat. We deliver solutions that help our nation and allies defend freedoms and deter aggression, creating a safer, more secure world. Advanced Technology is seeking a multi-disciplinary Engineering Project Leader that is responsible for the strategy and development of a microelectronics packaging portfolio that includes the development and use of 2.5D and 3D heterogeneous integration (3DHI) to increase the functional density of RF and mixed-signal sub-systems. In this role, a successful candidate will provide technical direction and expertise during new program capture and execution of Contract Research and Development (CRAD) programs, as well as working across the Raytheon enterprise to support further maturation and transition into operational programs. Additionally, you will identify strategic product development opportunities and propose/coordinate Independent Research and Development (IRAD) projects across programs and product lines. You will work closely with engineers across technical disciplines, and will be highly visible, influential, and accountable within Raytheon’s programs and leadership community. This position is onsite and can be located at Tewksbury, MA; McKinney, TX; or Goleta, CA.

Requirements

Typically requires Bachelor’s degree in Science, Technology, Engineering, or Mathematics (STEM) and minimum of 12 years of prior relevant experience.
Experience with microelectronics design and development with emphasis on microelectronics packaging.
Experience writing and/or leading responses to solicitations (RFIs, RFPs, etc.), including white papers and/or proposals.
Experience managing program cost, schedule, and technical performance.
Experience leading cross-functional teams including, but not limited to principal investigator, engineering, contracts, finance, procurement/supply chain, and/or manufacturing/operations.
Active and transferable Top Secret U.S. government issued security clearance is required prior to start date with the ability to obtain a Top Secret/SCI clearance and/or program access after start.
U.S. citizenship is required, as only U.S. citizens are eligible for a security clearance.

Nice To Haves

Experience in high-performance RF system design and high-performance mixed-signal systems.
Expert knowledge in microelectronics packaging to include electrical, mechanical and thermal design constraints.
Experience with state-of-the-art 2.5D and 3D microfabrication and assembly techniques.
Experience across the full product development lifecycle.
Demonstrated excellence in interacting with customers and decision makers
Excellent communication ability in verbal, written and presentation formats
Knowledge of Department of War and Intelligence Community operational concepts.
Experience with capturing and executing programs within the Department of War and Intelligence Community Science and Technology organizations to include DARPA and the service laboratories.
Familiarity with government acquisition process.
5+ years of experience successfully managing technology development programs and IRAD projects.
Well-organized with the ability to prioritize and manage a high-mix workload (multiple projects at once).
Ability to obtain Program Management (Level 4) and EV Certification.
Advanced degree such as MS or PhD in physics, circuits, material science, mechanical engineering, or other related engineering field.

Responsibilities

Work closely with the Senior Leadership and integrated functional teams to develop new business capture strategies and then lead the capture and management of the resulting projects.
Perform regular customer interactions to develop strategic and emerging microelectronic packaging opportunities, white papers and proposals.
Align the program teams to customer priorities through requirements development, mission analysis, shaping, and pre-design to provide clear direction and actively manage risk mitigation strategies and capture program opportunities.
Lead trade studies to consider 2.5D and 3D integration strategies using monolithic and chiplet-based architectures to meet system needs.
Lead/manage interposer fabrication and assembly strategy that spans multiple Raytheon manufacturing sites and 3rd party suppliers.
Lead technical white papers and proposal volumes through cross-organizational collaboration to deliver customer-focused and high-scoring content.
Guide, apprentice, mentor, and train employees within the RF, mixed-signal, system integration and packaging technical domains.
Responsible for management and reporting of portfolio investment budget.
Travel for customer engagements.