Associate, Computer / Electrical Engineer (FPGA Development)

L3HHCM20•Palm Bay, FL

2d•Onsite

About The Position

This role involves preparing component drawings and specifications for highly complex products, supporting engineering and purchasing for parts and materials, and interfacing with labs to interpret test results. The position requires effective communication with program engineers, management, and customers on technical issues and status. The Associate Engineer will act as a technical consultant, perform technical reviews of documentation, and follow established procedures under the guidance of senior staff. The role also encompasses design, analysis, modification, testing, and evaluation of FPGA and programmable hardware, as well as designing complex Circuit Card Assemblies for Avionics and Space customer's photonic subsystems and integrated communication systems. Specific areas of focus include Digital Engineering, Modem Design, DSP design, Microelectronics Design, RF Engineering, Photonics Engineering, Antenna Engineering, Hardware Design Verification, and Optical Engineering.

Requirements

Pursuing a Bachelor’s degree in Electrical Engineering, Computer Engineering, Electrical & Computer Engineering, Materials Engineering, Materials Science Engineering or related field.
Completed Bachelor’s degree within the last 12 months.
Digital Design requires programmable logic, VHDL language and digital communications systems knowledge.
Modem Design requires knowledge of digital communications systems, waveform generation and signal processing, FPGA design (in VHDL) and familiarity with Digital Signal Processors chips.
DSP design positions require knowledge of digital signal processing techniques, algorithm development, software coding and simulation/modeling using MATLAB.
Microelectronics Design requires training in advanced electronics packaging and MEMS technology.
Familiarity with common commercial RF design and analysis tools to design and analyze RF circuits and systems (i.e. ADS, HFSS, CST, MATLAB, etc).
Utilize design tools such as HFSS, CST, MATLAB, and GRASP.
Utilize tools such as network analyzers and LabVIEW.
Familiarity with various computing environments (LINUX/Windows).

Nice To Haves

Experience with high density interconnect and semiconductor packaging technology is desired.
Knowledge and/or experience with VHDL, MCM, HFSS, Network, Power, Analog, Antennas, Controls, ENE, RF, Photonics, Modem, EDA, DSP, MATLAB, Communication Systems, FPGA, Aerospace industry or Optical Engineering.
Knowledge of Code V and/or Zemax software tools.
Excellent communication, technical writing and presentation skills.
Knowledge of FRED, Matlab, Python.
Knowledge of and/or understanding circuit analysis and operational concepts.

Responsibilities

Prepare component drawings and specifications for highly complex products.
Provide support to engineering and purchasing for procurement and selection of parts and materials.
Prepare nonstandard part and material submittals.
Interface and work with inside and outside labs to interpret test results and define testing.
Effectively communicate with program engineers, management, and customers on technical issues and status of work.
Present results of analysis to program engineers and customers.
Act as a technical consultant in areas of expertise.
Perform technical reviews of material/component quality documentation.
Follow established procedures and specific, detailed instructions and/or guidance from more senior functional staff.
Design, analyze, modify, test and evaluate FPGA and programmable hardware.
Design complex Circuit Card Assemblies to support Avionics and Space customer’s photonic subsystems and integrated communication systems.
Determine design approaches and parameters.
Perform system analysis to determine feasibility of design within time and cost constraints.
Utilize modeling tools and equipment to establish operating data, conduct experimental tests, and evaluate results.
Select components and equipment based on analysis of specifications and reliability.
Perform simulations and present design reviews to peer engineers.
Write scripts to control synthesis and build tool.
Perform RF/Microwave Device testing and evaluation including s-parameter, large signal load pull characterization as well as modulated signal measurements.
Analyze electrical requirements to determine feasibility of design within time and cost constraints.
Analyze equipment to establish operating data, conducts experimental tests and evaluates results.
Design, analyze, modify, test and evaluate optical communications systems and subsystem level components.
Design, analyze, modify, test and evaluate RF Photonic systems and subsystem level components.
Design, analyze, modify, test, and evaluate antenna systems and subsystem level components.
Evaluate antennas in anechoic chambers and use network analyzers.
Design and modify tests to verify the operational state of various L3Harris products and accessories.
Test, analyze, and evaluate the requirements compliance of L3 Harris hardware products.
Perform optical design and analysis on advanced telescopes, calibrators, unique optical test sets.
Develop optical budgets and sensitivities including wavefront error, MTF, line of sight, and throughput.
Perform analyses to show compliance to optical requirements and specifications for imaging systems, assemblies, component drawings, coatings, etc.
Perform tolerancing analyses to assess manufacturability and optical alignment.
Provide optical modeling, analysis and metrology support during system alignment, integration and testing.
Perform other unique modeling tasks, such as: spectral tuning/splitting, polarization, phase retrieval, image simulation, etc.
Support the development of optical technologies and architectural concepts to support the company’s current and new business opportunities.