Assembly Process Development Engineer

MACOM Technology Solutions Holdings, Inc.•Morgan Hill, CA

4d•$117,000 - $171,000•Onsite

About The Position

MACOM designs and manufactures semiconductor products for Data Center, Telecommunication, and Industrial and Defense applications. Headquartered in Lowell, Massachusetts, MACOM has design centers and sales offices throughout North America, Europe, and Asia. MACOM is certified to the ISO9001 international quality standard and ISO14001 environmental management standard. MACOM has more than 75 years of application expertise with multiple design centers, Si, GaAs, and InP fabrication, manufacturing, assembly and test, and operational facilities throughout North America, Europe, and Asia. In addition, MACOM offers foundry services that represents a key core competency within our business. MACOM sells and distributes products globally via a sales channel comprised of a direct field sales force, authorized sales representatives, and leading industry distributors. Our sales team is trained across all of our products to give our customers insights into our entire portfolio.

Requirements

BS. MS preferably in mechanical, material, industrial Engineering, Material Engineering, Applied Science, or other relevant qualification
Minimum 8+ years of relevant experience in the function of package and assembly process development such as die attach, SMT, Lid attach.
Must be able to utilize die bond equipment such as Datacon EVO.
Possess in depth technical knowledge and hands on experience on semiconductor backend assembly processes for RF Power Packages
Hands on experience on engineering methods such as FMEA/DFMEA/PFMEA, SPC, Pareto Analysis, Control Charts, 8D methodology and DoE.
Proven experience in project management, document accurately, communicate with intention, report efficiently, pre-empt risk, and drive for the best possible outcome for the customer, for the company, and for the team members
Solid experience and technical understanding in semiconductor reliability standards and test methods

Nice To Haves

Experience in materials characterization and analysis, DOE, reliability standards, and FA technique is preferred
Experience in low, medium and high-volume manufacturing for high RF Power Products is preferred

Responsibilities

Developing Backend Assembly Process and/or Package Developments for RF Power products
Participate in technology development projects which may include: defining the specifications, guidelines and developing assembly processes with process recipe development, equipment upgrade and material selection
Anticipate and propose solution to mitigate potential issues and limitation of process/material/equipment throughout the development stages.
Perform continuous improvement activities of existing assembly processes, equipment and materials for quality improvement and cost saving
Design new customized tooling to adopt off the shelf equipment for our high-volume production.
Perform verification and qualification activities for new tooling, machine and materials in development projects
Work directly with equipment vendors, subcontractors and internal team to qualify, bring up and debug equipment.
Creation, regular review and updating of design & equipment process FMEA
Technical support on Manufacturing with troubleshooting and providing technical solution
Participate in new product introduction with material selection, process developments, and data review, as technical expert
Conduct risk assessments and mitigation as well as project reviews and report the results to the executive level on a regular basis
Coordinate and support initial mechanical reliability test with failure analysis for root cause finding