Assembler Technician

Solid State Devices•La Mirada, CA

12d•Onsite

About The Position

Solid State Devices, Inc. (SSDI) is seeking a motivated Assembler Technician to join their dynamic team in the Wafer Fab. This is an opportunity to grow within a high-tech, cleanroom-based manufacturing environment. As a team member, you will be trained to perform various tasks related to semiconductor manufacturing, including sandblasting, bonding, inspection, and coating of diodes, as well as specialized tasks like diffusion, metal evaporation, and wafer dicing. Comprehensive on-the-job training will be provided to ensure safety, accuracy, and process compliance.

Requirements

High School Diploma / GED
Ability to perform basic math calculations (addition, subtraction, multiplication, division)
6-months of working experience in a relevant production or manufacturing position

Nice To Haves

Computer Skills - Microsoft Office 365 (Excel, Word, Outlook)

Responsibilities

Sand Blast Dicing - Precision cutting of semiconductor wafers using sandblasting equipment
Pinbond / Leadbond - Bonding of diode components to pins or leads using specialized tools
Diode Precap Activities - Pre-sealing inspection and preparation of diodes
Diode Passivation - Application of protective coatings to semiconductor devices
Diode Visual Mechanical Inspection - Visual and mechanical quality checks to ensure part conformance
Fill Out Manufacturing Process Procedures (MPPs) - Accurate completion of documentation for each production step
Read and Interpret Figure Drawings & Assembly Instructions - Follow detailed technical drawings and written procedures
Diffusion Boat Load - Safely load semiconductor wafers into quartz boats for high-temperature diffusion processes
Diffusion Run - Operate and monitor diffusion furnaces to introduce dopants into wafers
Metal Evaporation - Perform thin-film metal deposition using evaporation systems
Metal Thickness Measurement - Use tools such as profilometers or ellipsometry to measure metal film thickness
Metal Sinter - Conduct thermal processing to bond metal contacts and improve material properties
Wafer Stacking - Carefully handle and stack wafers for processing and transport
Wafer Mount for Saw Cut and Dismount - Prepare wafers for dicing by mounting them on tape, and remove them post-cut
Relative Strength Measurement (Rs) - Measure sheet resistance of conductive films using appropriate metrology tools
Wafer Saw Dicing - Program and operate wafer saws, including blade and flange changes, to precisely dice wafers
Diode Test - Perform electrical testing on diodes to verify performance specifications