Assembler Technician

Solid State Devices, IncWhittier, CA
Onsite

About The Position

Solid State Devices, Inc. (SSDI) is seeking a motivated Assembler Technician to join their dynamic team in the Wafer Fab. This role offers an excellent opportunity for growth within a high-tech, cleanroom-based manufacturing environment. The Assembler Technician will be trained to perform a variety of tasks related to semiconductor manufacturing, including precision cutting, component bonding, inspection, passivation, and quality checks. Additionally, specialized training will be provided for processes such as diffusion, metal evaporation, and wafer dicing. Comprehensive on-the-job training will be provided to ensure safety, accuracy, and process compliance.

Requirements

  • High School Diploma / GED
  • Ability to perform basic math calculations (addition, subtraction, multiplication, division)

Nice To Haves

  • Computer Skills - Microsoft Office 365 (Excel, Word, Outlook)
  • 6-months of working experience in a relevant production or manufacturing position

Responsibilities

  • Sand Blast Dicing - Precision cutting of semiconductor wafers using sandblasting equipment
  • Pinbond / Leadbond - Bonding of diode components to pins or leads using specialized tools
  • Diode Precap Activities - Pre-sealing inspection and preparation of diodes
  • Diode Passivation - Application of protective coatings to semiconductor devices
  • Diode Visual Mechanical Inspection - Visual and mechanical quality checks to ensure part conformance
  • Fill Out Manufacturing Process Procedures (MPPs) - Accurate completion of documentation for each production step
  • Read and Interpret Figure Drawings & Assembly Instructions - Follow detailed technical drawings and written procedures
  • Diffusion Boat Load - Safely load semiconductor wafers into quartz boats for high-temperature diffusion processes
  • Diffusion Run - Operate and monitor diffusion furnaces to introduce dopants into wafers
  • Metal Evaporation - Perform thin-film metal deposition using evaporation systems
  • Metal Thickness Measurement - Use tools such as profilometers or ellipsometry to measure metal film thickness
  • Metal Sinter - Conduct thermal processing to bond metal contacts and improve material properties
  • Wafer Stacking - Carefully handle and stack wafers for processing and transport
  • Wafer Mount for Saw Cut and Dismount - Prepare wafers for dicing by mounting them on tape, and remove them post-cut
  • Relative Strength Measurement (Rs) - Measure sheet resistance of conductive films using appropriate metrology tools
  • Wafer Saw Dicing - Program and operate wafer saws, including blade and flange changes, to precisely dice wafers
  • Diode Test - Perform electrical testing on diodes to verify performance specifications

Benefits

  • Medical, Dental, and Vision Insurance
  • Group Life Insurance & AD&D (Accidental Death and Dismemberment)
  • Voluntary Term Life Insurance & AD&D
  • Paid Time Off (PTO)
  • 8 Paid Holidays
  • 401(k) Retirement Plan with Company Match
  • Roth 401(k)
© 2026 Teal Labs, Inc
Privacy PolicyTerms of Service