Assembler Technician

Solid State Devices • La Mirada, CA

12d • Onsite

About The Position

Solid State Devices, Inc. (SSDI) is seeking motivated Assembler Technicians to join their dynamic team in the Wafer Fab. This is an opportunity to grow within a high-tech, cleanroom-based manufacturing environment. Team members will be trained to perform various tasks related to semiconductor manufacturing, including sandblasting, bonding, inspection, passivation, and visual mechanical checks. Specialized training will also be provided for tasks such as diffusion boat loading, furnace operation, metal evaporation and sintering, wafer stacking, dicing preparation and execution, and electrical testing of diodes. Comprehensive hands-on training will be provided to ensure safety, accuracy, and process compliance.

Requirements

• High school diploma or equivalent (GED)
• Basic math skills

Nice To Haves

• Microsoft Office Suite (Excel, Word, Outlook)
• 6-months of working experience in a relevant production or manufacturing position

Responsibilities

• Sand Blast Dicing - Precision cutting of semiconductor wafers using sandblasting equipment
• Pinbond / Leadbond - Bonding of diode components to pins or leads using specialized tools
• Diode Precap Activities - Pre-sealing inspection and preparation of diodes
• Diode Passivation - Application of protective coatings to semiconductor devices
• Diode Visual Mechanical Inspection - Visual and mechanical quality checks to ensure part conformance
• Fill Out Manufacturing Process Procedures (MPPs) - Accurate completion of documentation for each production step
• Read and Interpret Figure Drawings & Assembly Instructions - Follow detailed technical drawings and written procedures
• Diffusion Boat Load - Safely load semiconductor wafers into quartz boats for high-temperature diffusion processes
• Diffusion Run - Operate and monitor diffusion furnaces to introduce dopants into wafers
• Metal Evaporation - Perform thin-film metal deposition using evaporation systems
• Metal Thickness Measurement - Use tools such as profilometers or ellipsometry to measure metal film thickness
• Metal Sinter - Conduct thermal processing to bond metal contacts and improve material properties
• Wafer Stacking - Carefully handle and stack wafers for processing and transport
• Wafer Mount for Saw Cut and Dismount - Prepare wafers for dicing by mounting them on tape, and remove them post-cut
• Relative Strength Measurement (Rs) - Measure sheet resistance of conductive films using appropriate metrology tools
• Wafer Saw Dicing - Program and operate wafer saws, including blade and flange changes, to precisely dice wafers
• Diode Test - Perform electrical testing on diodes to verify performance specifications

Benefits

• Medical, Dental, and Vision Insurance
• Group Life Insurance & AD&D (Accidental Death and Dismemberment)
• Voluntary Term Life Insurance & AD&D
• Paid Time Off (PTO)
• 8 Paid Holidays
• 401(k) Retirement Plan with Company Match
• Roth 401(k)

What This Job Offers

• Job Type: Full-time
• Career Level: Entry Level
• Education Level: High school or GED