Assembler Tech (Wafer Fab)

Solid State Devices, Inc•La Mirada, CA
•Onsite

About The Position

Solid State Devices, Inc. (SSDI) is seeking a motivated Assembler Tech to join their dynamic team in the Wafer Fab. This role offers an opportunity for growth within a high-tech, cleanroom-based manufacturing environment. The position involves performing various tasks related to semiconductor manufacturing, with comprehensive on-the-job training provided.

Requirements

  • High School Diploma / GED
  • 6-months of working experience in a relevant production or manufacturing position
  • Ability to perform basic math calculations (addition, subtraction, multiplication, division)
  • Microsoft Office (Excel, Word, Outlook)

Responsibilities

  • Diode Passivation - Application of protective coatings to semiconductor devices
  • Diode Precap Activities - Pre-sealing inspection and preparation of diodes
  • Diode Visual Mechanical Inspection - Visual and mechanical quality checks to ensure part conformance
  • Pinbond / Leadbond - Bonding of diode components to pins or leads using specialized tools
  • Read and Interpret Figure Drawings & Assembly Instructions - Follow detailed technical drawings and written procedures
  • Sand Blast Dicing - Precision cutting of semiconductor wafers using sandblasting equipment
  • Diffusion Boat Load - Safely load semiconductor wafers into quartz boats for high-temperature diffusion processes
  • Diffusion Run - Operate and monitor diffusion furnaces to introduce dopants into wafers
  • Diode Test - Perform electrical testing on diodes to verify performance specifications
  • Metal Evaporation - Perform thin-film metal deposition using evaporation systems
  • Metal Thickness Measurement - Use tools such as profilometers or ellipsometry to measure metal film thickness
  • Metal Sinter - Conduct thermal processing to bond metal contacts and improve material properties
  • Wafer Stacking - Carefully handle and stack wafers for processing and transport
  • Wafer Mount for Saw Cut and Dismount - Prepare wafers for dicing by mounting them on tape, and remove them post-cut
  • Relative Strength Measurement (Rs) - Measure sheet resistance of conductive films using appropriate metrology tools
  • Wafer Saw Dicing - Program and operate wafer saws, including blade and flange changes, to precisely dice wafers

Benefits

  • Medical, Dental, and Vision Insurance
  • Group Life Insurance
  • Term Life Insurance
  • Long Term Disability Insurance
  • Paid Time Off (PTO)
  • 8 Paid Holidays
  • 401(k) Retirement Plan (Company Match)
  • Roth 401(k)
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