ASIC Packaging Signal/Power Integrity Hardware Engineer (Hybrid)

Cisco•San Jose, CA

3d•$152,500 - $252,000•Hybrid

About The Position

We are seeking a qualified Signal and Power Integrity Engineer to help us develop our next generation ASIC packaging to help define, design and verify ASIC packaging to be deployed in a range of Cisco platforms. Develop, document, and implement design rules for ultra-high-speed signaling, ensuring power, performance, and area goals are met for products. Analyze substrate signal integrity (SI) and power integrity (PI), providing feedback and collaborating with the layout team to develop optimal solutions across interposer, substrate, and PCB. Design, document, and develop ASIC packages for high-volume, high-quality release, including post-layout extraction and reporting. Collaborate with system partners, vendors, and design leads to achieve combined power and signal integrity and to resolve complex technical issues using advanced technology design rules.

Requirements

Bachelor's degree in Electrical Engineering and 4+ years of relevant signal and power integrity experience, or Master's degree in Electrical Engineering and 2+ years of relevant signal and power integrity experience, or PhD in Electrical Engineering and 0+ years of related experience, or equivalent related work experience.
High-Speed Design & Theory: Expertise in high-speed design principles, including Transmission Line Theory, electromagnetics, scattering parameters, and impedance network analysis, applied to 56G PAM4 SerDes architectures, channel modeling, and BER prediction.
SI/PI Simulation Proficiency: Experience with pre- and post-layout signal and power integrity (SI/PI) simulations using industry-standard EDA tools such as Cadence Sigrity, Ansys HFSS, and Keysight ADS.
Layout Review & Physical Validation: Experience conducting detailed layout reviews and physical design validation using tools such as Cadence APD and Ansys EM flows to ensure signal performance and crosstalk mitigation.
Circuit Analysis: Working knowledge of SPICE for circuit-level analysis, signal modeling, and performance validation.

Nice To Haves

Skilled in articulating ideas and technical concepts to diverse audiences, both verbally and in writing.
Experience with high-bandwidth memory (HBM) or high-speed memory interface SI.
Experience with die-to-die interfaces (UCIe or proprietary).
Experience with advanced packaging (CoWoS, EMIB, interposer-based designs), including SI/PI analysis of 2.5D ASIC packaging.
Working knowledge of Vector Network Analysis.
Basic knowledge of IBIS.

Responsibilities

Develop, document, and implement design rules for ultra-high-speed signaling, ensuring power, performance, and area goals are met for products.
Analyze substrate signal integrity (SI) and power integrity (PI), providing feedback and collaborating with the layout team to develop optimal solutions across interposer, substrate, and PCB.
Design, document, and develop ASIC packages for high-volume, high-quality release, including post-layout extraction and reporting.
Collaborate with system partners, vendors, and design leads to achieve combined power and signal integrity and to resolve complex technical issues using advanced technology design rules.

Benefits

medical, dental and vision insurance
a 401(k) plan with a Cisco matching contribution
paid parental leave
short and long-term disability coverage
basic life insurance
10 paid holidays per full calendar year
1 floating holiday for non-exempt employees
1 paid day off for employee’s birthday
paid year-end holiday shutdown
4 paid days off for personal wellness
16 days of paid vacation time per full calendar year (non-exempt)
flexible vacation time off program (exempt)
80 hours of sick time off provided on hire date and each January 1st thereafter
up to 80 hours of unused sick time carried forward from one calendar year to the next
Optional 10 paid days per full calendar year to volunteer
annual bonuses (for non-sales roles)
performance-based incentive pay (for sales roles)