We are seeking a qualified Signal and Power Integrity Engineer to help us develop our next generation ASIC packaging to help define, design and verify ASIC packaging to be deployed in a range of Cisco platforms. This role involves developing, documenting, and implementing design rules for ultra-high-speed signaling, ensuring power, performance, and area goals are met for products. The engineer will analyze substrate signal integrity (SI) and power integrity (PI), providing feedback and collaborating with the layout team to develop optimal solutions across interposer, substrate, and PCB. Additionally, the role includes designing, documenting, and developing ASIC packages for high-volume, high-quality release, including post-layout extraction and reporting. Collaboration with system partners, vendors, and design leads is essential to achieve combined power and signal integrity and to resolve complex technical issues using advanced technology design rules.
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Job Type
Full-time
Career Level
Senior