APTM Yield Analysis Senior Engineer / Team Leader

Intel Corporation•Hillsboro, OR

10d•$190,610 - $269,100•Onsite

About The Position

The Advanced Packaging Technology and Manufacturing (APTM) Yield Group is seeking a Yield Analysis and Defects Lead Engineer to drive yield and defect improvement initiatives across Intel's advanced packaging technology portfolio. In this role, you will lead efforts to identify, analyze, and resolve yield-limiting mechanisms throughout technology development and high-volume manufacturing (HVM). You will work with large-scale datasets, advanced analytics, inline metrology systems, and cross-functional engineering teams to improve manufacturing processes, test methodologies, and defect detection capabilities. The successful candidate will establish team priorities, influence technical roadmaps, drive results across organizational boundaries, and ensure progress toward key yield milestones. This position offers the opportunity to become a technical expert in advanced packaging technologies while solving complex manufacturing and yield challenges.

Requirements

Bachelor's degree with 9+ years of experience, OR Master's degree with 6+ years of experience, OR PhD with 4+ years of experience In Materials Science and Engineering, Mechanical Engineering, Chemical Engineering, Electrical Engineering, Computer Science, Information Systems, Physics, Chemistry, or a related technical discipline.
5+ years of experience performing data analysis using tools like JMP, Python, or similar statistical and data analysis tools.

Nice To Haves

Experience applying advanced statistical analysis techniques to manufacturing or yield-related problems.
Experience utilizing structured technical problem-solving methodologies.
Knowledge of semiconductor product design, circuit design, or architecture as it relates to yield analysis.
Knowledge of inline defect metrology systems and their application to yield improvement.
Experience with semiconductor manufacturing, advanced packaging technologies, or high-volume manufacturing environments.
Experience working with large manufacturing datasets, databases, and data visualization tools.
Experience leading technical projects or mentoring engineering teams.

Responsibilities

Extract insights from structured and unstructured datasets using statistical analysis, machine learning techniques, and data mining methodologies.
Analyze large volumes of manufacturing, test, and defect data to identify yield-impacting trends and opportunities for improvement.
Develop and implement solutions using manufacturing process knowledge, statistical methods, and structured problem-solving techniques.
Drive recommendations and influence yield improvement roadmaps across technology development and manufacturing organizations.
Analyze the relationship between electrical failures and physical defects through the application of: Failure Isolation and Failure Analysis (FIFA), Design for Test (DFT), Sort and Test methodologies, Process Integration, Manufacturing process flows, Data mining and database analysis, Data visualization techniques.
Evaluate inline defect metrology performance, detection capabilities, and defect monitoring systems used in manufacturing.
Partner with Process Engineering, Integration, Quality and Reliability (Q&R), Product Engineering, and Test Development Engineering teams to resolve yield and defect challenges.
Prepare and present detailed technical reports on yield performance, defect trends, and device health metrics.
Define and drive corrective actions necessary to achieve world-class yield performance.
Collaborate with upstream, downstream, and cross-functional stakeholders to support technology development, technology transfer, and successful ramp to high-volume manufacturing.
Lead and mentor small teams of engineers in direct or indirect leadership capacities.
Travel domestically and internationally as required.