Application Engineering Director

Diamond Foundry•Bay Area, California, CA

18d•$180,000 - $250,000•Onsite

About The Position

Diamond Foundry Inc. is solving the thermal limitation at the foundation of today's most exciting tech industries -- AI & cloud compute, electric-car power electronics, and 5G/6G wireless. We have managed to produce the world's first single-crystal diamond wafers and are now on a mission to put a diamond behind every chip. We are the rare unicorn that has grown fast and profitably. We received $515m in funding and are executing a multi-$B expansion plan for one of the greenest forms of manufacturing: converting greenhouse gas into diamond wafers using zero-emission energy. Diamond Foundry is revolutionizing industries with single-crystal diamond, the ultimate material for advanced electronics and thermal management. As the world's leading producer of lab-grown diamond, we are expanding our application engineering team to support our growing customer base in the semiconductor industry. We seek a highly motivated and experienced Application Engineering Manager to drive the adoption of our cutting-edge diamond solutions in advanced packaging and thermal applications.

Requirements

Bachelor's or Master's degree in Materials Science, Chemistry, Electrical Engineering, Mechanical Engineering, or a related field with a minimum of 8+ years of experience in semiconductor packaging and/or thermal management applications.
Deep understanding of semiconductor packaging technologies, thermal management principles, and material characterization techniques, including advanced packaging basic understanding, including 2.5D/3D IC thermal solutions.
Demonstration of exceptional ability and accomplishments, including hands-on development, integration, troubleshooting, and implementation of solutions.
Ability to execute from concepts and R&D to scaling and mass production.
Strong knowledge of the semiconductor industry, systems engineering, reliability and compliance demonstration, and technology transfers, particularly in advanced packaging and thermal management.
Proven ability to lead and manage cross-functional engineering teams, coupled with excellent communication, presentation, and interpersonal skills to support both internal collaboration and external business development and customer engagement.
Experience with high thermal conductivity materials and advanced packaging.

Responsibilities

Lead and grow the application engineering function focused on semiconductor packaging and thermal management applications.
Drive the technical development, execution, and optimization of diamond-based solutions for advanced packaging and thermal management interfaces, integrating state-of-the-art material solutions and processes.
Provide in-depth technical expertise on thermal management principles and material characterization.
Collaborate with the R&D and product development teams to define product roadmaps, identify new application opportunities, and drive product improvements.