The APL Quantum Intern will contribute to quantum advanced packaging development, including wafer-to-wafer hybrid bonding, die-to-wafer hybrid bonding, through-silicon via/through-oxide via (TSV/TOV), and interposer development. The intern will work alongside engineering teams to execute experiments, analyze results, model processes, and support daily integration and process-development activities.
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Job Type
Full-time
Career Level
Intern