AI Research Engineer/Scientist

Intel Corporation•Santa Clara, CA

2d•$170,500 - $240,710•Hybrid

About The Position

Since the announcement of the world's first on-chip silicon photonics laser more than a decade ago, Intel continues to lead the industry with cutting-edge technology, silicon photonics integration, and scalable AI systems. Our dedication to advanced development ensures that Intel Silicon Photonics continues to drive future bandwidth growth in data center networks and AI infrastructure, with higher density, better power efficiency, and faster speeds. In the future we will deploy co-packaged silicon photonics optical I/O chip lets to enable higher performance, larger-scale and more power efficient AI systems. We are looking for great talent to accelerate this journey so if you are interested in joining our organization we want to hear from you. In this position, the selected candidate will join the Corporate Technology Office Team, contributing to its mission of advancing datacenter connectivity and strengthening Intel's competitive edge in scalable AI system design. As an expert in Electronic-Photonic IC co-design, the individual will be responsible for developing electro-optical architecture for research and development (R/D) purposes.

Requirements

Ph.D. in Electrical and Computer Engineering, Optics and Optical Engineering.
Track record of peer-reviewed publications and/or patents in the simulation, design, optimization and implementation of heterogeneously integrated electro-optical devices, as well as Electronic-Photonic ICs.
At least 3 years of experience in digital and mixed-signal design flows with proven track record of successful tapeouts.
Excellent oral and written communication skills.

Nice To Haves

Strong proficiency with electronic and photonic integrated circuit (EIC and PIC) design CAD tools.
Extensive design experience using hardware description languages (Verilog, Verilog-A) and high-level programming languages (C/C++, python).
Deep expertise in the design and optimization of active and passive optoelectronic modulators.
Knowledgeable in 2.5D/3D packaging and integration techniques.
Familiarity with switch fabric architectures and related routing algorithms.
Hands-on experience in laboratory testing and characterization of integrated circuits.
Solid understanding of high-speed analog circuitry, including transimpedance amplifiers (TIAs) and modulator drivers.
Proven experience of building end-to-end simulation frameworks bridging electronics, photonics and packaging.

Responsibilities

Define architectures and designs that meet specifications and performance targets for next-generation optical interconnects.
Optimize core integrated circuit electro-optical components.
Collaborate with cross-functional teams to lead overall project development.
Develop simulation methodologies for scalable electro-photonic systems.
Design digital and mixed-signal accelerators for state-of-the-art algorithms.
Advise on the development of test plans for post-silicon characterization.
Thoroughly document all design work with review materials and detailed design descriptions.