Advanced R&D Engineer/Scientist

Solstice Advanced Materials•Sunnyvale, CA

About The Position

As an R&D Engineer/Scientist at Solstice, you will play a critical role in developing next-generation materials and solutions that enable advanced semiconductor packaging and high-performance computing applications. You will lead the design, development, characterization, and commercialization of innovative advanced semiconductor packaging technologies, partnering closely with customers, cross-functional teams, and external partners to solve complex heat management challenges. You will report directly to the Senior Manager R&D (Applications Development) and work closely with customers, marketing, manufacturing, technical services, and product development organizations. In this role, you will serve as both a technical expert and strategic partner, translating market needs into scalable product solutions that create value for customers and drive growth for Solstice.

Requirements

Master’s degree (Ph.D. preferred) in Material Science, Chemical Engineering, Polymer Science, or Chemistry
3+ years of hands-on industry or research experience in packaging module development involving innovative assembly materials—such as underfills, molding compounds, adhesives, and substrates—to enable next-generation semiconductor technologies like 2.5D/3D integration.
Proven experience in customer engagement by bridging R&D with customer needs, by being a technical liaison to the market across a broad range of products and technologies.

Nice To Haves

Technical expertise: deep knowledge of advanced packaging architectures like flip-chip, 2.5D/3D stacking, wafer-level packaging, and heterogeneous integration. Good understanding how foundries (factories that build wafers) and OSATs (Outsourced Semiconductor Assembly and Test facilities) build and test packages. Strong knowledge of structure-property-performance correlations in polymers/metals and familiarity with failure analysis tools (SEM, X-Ray, CSAM).
Customer Interface: Act as the technical expert to help clients optimize polymers, adhesives, and metals that hold micro-chips together. Partner with the customer in product selection and qualification in their application.
Strategic Planning: Ability to turn complex customer problems into scalable, market-leading solutions which create value.
Collaboration: demonstrated ability to partner with cross-functional teams involving Synthesis & Formulation R&D, manufacturing, quality and technical services to scale prototype concepts into high-volume mass production.
Communication skills: strong ability to present complex technical data clearly to clients and internal teams.

Responsibilities

Lead the development and commercialization of materials and technologies for advanced semiconductor packaging from concept through scale-up and commercial launch.
Partner directly with customers to understand technical challenges, provide applications support, and identify opportunities for new product development.
Generate applications data through simulation, modeling, and experimental testing to solve chip-level and package-level thermal management challenges.
Collaborate with cross-functional teams including R&D, manufacturing, quality, marketing, and technical services to transition new technologies into commercial production.
Establish material specifications and qualification requirements to support manufacturing readiness and customer adoption.
Apply statistical analysis, Design of Experiments (DOE), and engineering methodologies to optimize product performance and process capability.
Partner with external suppliers, research organizations, and industry partners to support technology development and roadmap alignment.
Communicate technical findings, business recommendations, and strategic opportunities to senior leadership, customers, and external stakeholders.