Advanced Packaging Process Engineer III E3)

Applied MaterialsSanta Clara, CA
$124,000 - $171,000Onsite

About The Position

Applied Materials is a global leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world. We design, build and service cutting-edge equipment that helps our customers manufacture display and semiconductor chips – the brains of devices we use every day. As the foundation of the global electronics industry, Applied enables the exciting technologies that literally connect our world – like AI and IoT. If you want to push the boundaries of materials science and engineering to create next generation technology, join us to deliver material innovation that changes the world. As a Process Engineer, you'll play a crucial role in designing and optimizing manufacturing processes for display and semiconductor manufacturing technologies. You will collect and analyze data, perform hardware characterization, and troubleshoot engineering issues. You'll also measure film properties, generate technical documentation, and engage with customers to resolve concerns. Process Engineers collaborate with vendors and suppliers, and become familiar with implementing new technologies and products. You will experiment, learn, and collaborate with some of the brightest minds in the semiconductor and display industries, partnering with our globally recognized R&D teams on state-of-the-art research and development projects. We are seeking a motivated and detail-oriented Process Development Engineer to join our team. This position offers a unique opportunity to work on advance packaging projects. The successful candidate will be working on process development related to packaging substrate fabrication.

Requirements

  • BS or MS Degree in Chemical Engineering, Material Science or a related field.
  • Strong analytical skills and proficiency in data analysis
  • Experience in back end of the line semiconductor or PCB device fabrication
  • Excellent communication and teamwork skills.
  • Ability to work independently and manage multiple tasks effectively.
  • Attention to detail and a proactive approach to problem-solving.

Nice To Haves

  • Experience in Cu electroplating processes
  • Experience with electronic packaging fabrication and characterization techniques.
  • Previous hand-on experience with tool operation and process development in PCB or semiconductor industry.

Responsibilities

  • Start up and qualify new equipment
  • Develop new processes and transfer to pilot production
  • Establish metrology protocol
  • Utilize statistical tools and software to analyze data and identify trends, anomalies, and opportunities for process optimization.
  • Prepare detailed reports and presentations summarizing findings and recommendations.
  • Support the development and implementation of process improvements based on experimental results.
  • Maintain accurate documentation of experiments, methodologies, and results.

Benefits

  • supportive work culture that encourages you to learn, develop, and grow your career
  • comprehensive benefits package
  • participation in a bonus and a stock award program
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