Advanced Packaging Platform Lead — Yield & Data Analytics

Advanced Micro Devices, Inc • Austin, TX

2d

About The Position

AMD is seeking an Advanced Packaging Platform Lead to own assembly and test yield for an advanced packaging platform, from new product introduction (NPI) through high-volume manufacturing. AMD products use advanced packaging technologies—including 2.5D/3D/3.5D heterogeneous integration, fan-out, and silicon bridge technologies—built through a global network of OSAT and foundry partners. The role is the single point of accountability for the platform’s packaging yield and works with OSAT and foundry partners, Product Engineering, Package Design, business units, and AMD leadership.

The ideal candidate can quickly synthesize complex topics, collaborate across organizations and with engineers and executives globally, and demonstrate initiative and strong ownership. The role also mentors analysts and helps shape AI-assisted analytics tools used by the team. AMD states that this role is not eligible for visa sponsorship.

Requirements

• Bachelor's, master's, or Ph.D. in Electrical Engineering, Mechanical Engineering, Materials, Chemical Engineering, or a related field.
• Strong SQL and Python skills, and comfort working directly with large manufacturing data sets such as Snowflake or similar.
• Clear communication skills, including the ability to brief executives and lead cross-functional task forces.

Nice To Haves

• Experience in semiconductor packaging, assembly, or test yield.
• Hands-on yield ramp experience in advanced packaging, including 2.5D/3D/3.5D heterogeneous integration, fan-out, silicon bridge, or hybrid bonding.
• A track record of driving OSAT and foundry partners to identify root causes and close yield issues.
• Experience with partner data systems, including B2B feeds, STDF (Standard Test Data Format), and die-level traceability.
• Use of AI or agentic tools in engineering analysis.
• Experience across multiple product segments, such as client, server, and data center.

Responsibilities

• Own packaging yield for a portfolio of advanced packaging products from NPI through ramp to high-volume manufacturing.
• Lead technical engagement with OSAT and foundry partners, including setting yield targets, running joint yield reviews, and driving corrective actions to an owner and committed date.
• Drive root cause analysis of yield issues using detection, bin analysis, inline and equipment data, and failure analysis, targeting no more than one day to first actionable insight.
• Build and maintain root cause Pareto analyses for each product and drive the top contributors to closure with partners.
• Publish a weekly yield report and lead yield reviews with the Business Unit, Product Engineering, and partner leadership.
• Define data-readiness requirements, including yield data feeds and die-level traceability, with OSAT and foundry partners ahead of each product’s first build.
• Mentor analysts and help shape AI-assisted analytics tools used by the team.

What This Job Offers

• Job Type: Full-time
• Career Level: Senior