Advanced Packaging Integration and Simulation Intern

Intel Corporation•Hillsboro, OR

4d•$120,898 - $120,902•Hybrid

About The Position

Intel Technology Research is advancing the future of AI and high-performance computing through innovative advanced packaging technologies and 3D heterogeneous integration. Enabling novel system architecture, developing innovating process integration and establishing predictive physics-based simulation capabilities are critical for enabling complex large form factor packages with high-bandwidth interconnect. As an Advanced Packaging Integration and Simulation Intern, you will collaborate with leading researchers, process engineers, and modeling experts to develop and assess next-generation package architectures. In this role, you will contribute to advanced Research and Dev across package integration, process flow definition and development, package modeling, yield and reliability assessment, and data analytics.

Requirements

Candidate must be pursuing a PhD degree in Mechanical Engineering, Materials Science and Engineering, Electrical Engineering, Physics, Manufacturing Engineering, or a closely related STEM discipline
Must be available to work full-time for the duration of a 3-month internship.
3+ months of academic or professional experience in one or more of the following areas:
Experience with laboratory experimentation, engineering data analysis, or simulation/modeling workflows.
Experience in process integration or hands-on module development.
Programming or data analysis experience using Python, MATLAB, JMP, R, or similar tools.
Statistical analysis, DOE, or machine learning for engineering applications.

Nice To Haves

6+ months of academic or professional experience in one or more of the following areas:
Advanced packaging, heterogeneous integration, wafer-level packaging, chiplet integration, or package assembly process development.
Thermal/mechanical/electrical modeling, finite element analysis preferred.
Failure analysis for semiconductor process and package assembly.

Responsibilities

Support advanced packaging integration activities across wafer-level and package-level process flows, including wafer level process, 2.5D/3D integration, chiplet integration, and hybrid bonding-related modules.
Develop and execute Design of Experiments (DOE) to understand relationships among package architecture, process conditions, material behavior, and electrical/mechanical performance.
Build, calibrate, and apply simulation models to understand mechanical characteristics of packages, interconnect quality, thermal performance, etc.
Conduct thermo-mechanical simulations to evaluate material responses to temperature, stress, and package-level loading conditions.
Analyze inspection, process, and simulation data to identify root causes of integration challenges and recommend improvement paths.
Collaborate with cross-functional teams to optimize process flows for yield, reliability, manufacturability, and package performance.
Present findings through technical presentations and potential publications.