APTM Advanced Packaging Dry Etch Development Manager

Intel Corporation•Hillsboro, OR

1d•Onsite

About The Position

Intel Foundry is seeking an exceptional Advanced Packaging Dry Etch Module Development Manager to lead our plasma etch technology development for next-generation packaging solutions. This role will drive the development and implementation of dry etch processes critical to Intel's industry-leading advanced packaging portfolio, including Foveros Direct, Foveros, and EMIB (Embedded Multi-die Interconnect Bridge) technologies. The successful candidate will manage a team of process engineers while maintaining deep technical involvement in plasma physics and etch system optimization. This position offers the opportunity to influence Intel's roadmap for technology leadership, manufacturing excellence, and enabling next-generation computing solutions.

Requirements

Master or PhD degree in Physics, Electrical Engineering, Materials Science, Mechanical Engineering, or a related field.
10+ years of relevant experience with a master's degree, 8+ years or experience with a PhD degree.
Plasma physics experience and hands-on experience working with various etch platform (ICP, CCP, RIE systems).
Project management experience, including developing schedules, tracking deliverables, and managing cross-functional collaborations.
Experience in the semiconductor industry.

Nice To Haves

Demonstrated ability to build and lead effective teams, including fostering an inclusive, productive, and innovative team culture.
Experience with vendor relations, including material quality assessments and performance management.
Strong knowledge of Design of Experiments (DOE) principles, problem-solving methodologies, and package interconnect technologies.

Responsibilities

Lead and manage a team of engineers, providing clear goal setting, differentiated performance management, and coaching to foster a productive and innovative work environment
Formulate long-term strategies for process roadmap to meet future requirements, ensuring Intel remains a leader in advanced packaging
Oversee development of production-worthy etch processes for high-volume manufacturing
Foster talent development for critical technical roles, and drive technical excellence and innovation within the etch team
Develop and execute project schedules, track milestones and deliverables, and ensure timely feedback between cross-functional teams
Drive dry etch module and segment related yield improvement initiatives and defect reduction programs
Partner with process integration, manufacturing operations to achieve manufacturing excellence and ensure seamless technology transfer to high-volume manufacturing