Advanced Package Engineer, Principal

Astera Labs•San Jose, CA

8d•$205,000 - $255,000•Onsite

About The Position

Astera Labs is seeking an Advanced Packaging Engineer, Principal to lead advanced packaging R&D for next-generation photonics products for scale-up and scale-out AI infrastructure applications. This is a senior individual contributor role focused on setting technical direction and driving packaging technology development for NPO and CPO products.

Requirements

B.S., M.S., or Ph.D. in Electrical Engineering, Materials Science, Mechanical Engineering, or a related field.
8+ years of experience in semiconductor or advanced packaging engineering, with demonstrated technical leadership.
Deep expertise in advanced packaging processes, including 2.5D/3D integration, flip-chip, hybrid bonding, Cu pillar, TSV, RDL, and overmold across wafer-, panel-, and die-level flows.
Experience with silicon photonics chip packaging and EIC/PIC integration.
Hands-on experience with advanced packaging materials, including underfill, molding compounds, dielectrics, adhesives, or optical-grade encapsulants.
Proven track record of equipment and process qualification with OSAT or tool suppliers.
Experience with PDK development and packaging design rule authoring.
Strong foundation in yield analysis, reliability characterization, and process capability methodologies such as Cpk and SPC.

Nice To Haves

Hands-on experience with CPO or NPO product development.
Experience with optical coupling or waveguide alignment for photonic integration.
Familiarity with photonics chip design and photonics devices
Familiarity with DFM and DFT for advanced packaging.

Responsibilities

Lead R&D for advanced packaging of optical chips, including 2.1D, 2.5D, and 3D integration.
Define and optimize wafer-level, panel-level, or die-level packaging process flows.
Drive EIC-to-PIC integration and broader optical device integration efforts.
Select and qualify packaging materials for advanced packaging.
Partner with OSAT, tool vendors, and material suppliers to drive equipment, process, and materials development.
Characterize and continuously improve yield, reliability, and process capability for NPO and CPO packages.
Develop and maintain packaging PDKs and design rules for NPO and CPO products.