Advanced Package and 3DIC Solutions Director

Cadence Systems • Austin, AZ

1d

About The Position

This position involves defining and leading the development of advanced packaging and 3DIC implementation flows for foundry and customer solutions. The person in this role is expected to develop excellent working relationships with Cadence R&D and product engineering teams as well as customers. Longer term, management responsibilities may be added to this role as the 3DIC services team is staffed up. The candidate is expected to be an expert in Allegro Package Designer (APD), with experience in various aspects of package design including routing laminates and RDL designs, coding technology files, creating rules and constraints, handling Ravel coding for 3D rules, and implementing bondwires, bumps, and 3D structures and designs.

Requirements

• Expert in Allegro Package Designer (APD), with experience routing laminates and RDL designs, coding technology files, creating rules and constraints, handling Ravel coding for 3D rules, and implementing bondwires, bumps and 3D structures and designs
• Experience with creating Virtuoso-ready APD package files
• Expertise in 3rd party packaging formats, including GDS, Gerber, IPC and DXF, both for import and export
• Bachelor’s degree in Electrical or Electronics Engineering
• Minimum 20 years experience with package design
• 10 years experience as an APD expert
• Strong knowledge of advanced packaging concepts
• Strong knowledge of 2.5D, 3DIC and stacked die technologies
• Strong customer-facing communication and problem-solving skills
• Strong personal drive for continuous learning and expanding professional skill sets
• Excellent verbal and written communication skills

Nice To Haves

• Experience using Allegro SKILL for scripting and automation
• RF and standard based (PCIe, LPDDR, UCIE) routing experience
• Master’s degree preferred in Electrical or Electronics Engineering
• Good programming knowledge with Allegro Skill and Ravel
• Understanding of chip level CMOS design concepts desired

Responsibilities

• Define and lead the development of advanced packaging and 3DIC implementation flows for foundry and customer solutions
• Develop excellent working relationships with Cadence R&D and product engineering teams as well as customers
• Potentially take on management responsibilities as the 3DIC services team is staffed up

Benefits

• Paid vacation
• Paid holidays
• 401(k) plan with employer match
• Employee stock purchase plan
• A variety of medical, dental and vision plan options
• Incentive compensation: bonus, equity

What This Job Offers

• Job Type: Full-time
• Career Level: Senior
• Number of Employees: 5,001-10,000 employees