4th Shift Backside Process Support Engineer

RTX•Andover, MA

2d•Onsite

About The Position

An exciting opportunity exists at Raytheon to join our weekend process support team for a 4th Shift Backside Process Support Engineer. This opportunity is to join the backside processes production work center working on gallium arsenide, gallium nitride, and III-V focal plane array fabrication within the RF Microelectronics/Module Design & Foundry Services (RFMicro) Department. This role requires a basic understanding of microelectronics processing techniques such as deposition, photolithography, and etch but will primarily concentrate responsibilities on III-V backside processing which includes wafering bonding/debonding and all aspects of bonded wafer processing. As a member of the RFMicro Department, the individual will be responsible for all deposition related processes of the semiconductor products fabricated in the Andover foundry. Daily duties include engineering support and training for manufacturing personnel, attending morning tier meetings, reviewing lots and wafers requiring special disposition, failure analysis of tools and processes, supporting work center leads in tool and process qualification efforts, looking for ways to reducing rework and scrap, and looking for ways to increase efficiency in the process line A significant portion of the role involves communicating with the manufacturing personnel, equipment teams, cell leads, and engineering leads to ensure the work center has the necessary resources to function efficiently. Presence on the manufacturing floor is required for quick resolution of issues and quick reaction time to prevent interruption to customer commitments. The ideal candidate will have a working understanding of microelectronics processing techniques such as deposition, photolithography, and etch, be an excellent communicator, and have a drive to learn and improve the areas in which they work. Ability to multitask with attention to detail, maintain organized and documented processes, and the ability to work well in small cross-functional teams is essential. This role will be 100% on-site and based in Andover, MA.

Requirements

Typically requires a degree in Science, Technology, Engineering or Mathematics (STEM)
A minimum of 6 years of prior relevant experience, or an advanced degree in a related field and minimum 4 years’ experience with semiconductor processing techniques such as photolithography, dry etching, metals evaporation, and optical or scanning electron microscope inspections
The ability to obtain and maintain a US security clearance. U.S. citizenship is required as only U.S. citizens are eligible for a security clearance.

Nice To Haves

A degree in Science, Technology, Engineering, or Mathematics (STEM)
Clearly and succinctly document and present process development status in meetings
Knowledge related to semiconductor processing and data analysis
Experience utilizing data analysis software packages (e.g. MATLAB, Python, SQL, JMP).
Experience with quality standards and audits
Ability to present and communicate effectively across different functions

Responsibilities

Processing wafers to create FETs, MMICs, and FPAs in a cleanroom environment.
Work autonomously with limited oversight.
Influence others regarding policies, practices, and procedures.
Review and disposition wafers on hold for evaluation in the work center
Work well in small, cross-functional teams, assist in maintaining or improving production processes.
Actively communicate with parties within and outside of the work center (other shift engineers, work center leads, operation leads, manufacturing personnel, equipment team, etc.)