3rd Party Memory PHY Technical Lead

Advanced Micro Devices, Inc•Austin, TX
•Hybrid

About The Position

The candidate will join a highly visible and influential team of high-speed physical interface (PHY) and mixed signal IP experts tasked with integration and support of 3rd Party Memory/Serdes PHY and mixed signal IP across all AMD products. The team works across a large swath of AMD integration and post-silicon teams as well as with IP vendors and AMD customers.

Requirements

  • Self-motivated to work independently as well as collaboratively with technical people across a variety of AMD and vendor/partner teams.
  • Problem solver mindset.
  • B.S. or M.S. Electrical Engineering preferred
  • Strong experience designing high-speed mixed-signal IP, ideally with system-level architecture experience.
  • Breadth of knowledge across the full IP hardware development process (or strong interest in developing it) and experience with integration IP into an SOC
  • Design knowledge of high-speed I/O SerDes or Memory PHY architectures and blocks, plus general mixed-signal IP, e.g. CTLE, FFE, DFE, VGA, CDR, PLL/DLL, TX driver, EMC, GPIO, etc.
  • Experience with advanced FinFET semiconductor technologies at and below 7nm.
  • Basic understanding of RTL, logic design, and digital circuits
  • Strong analytical/problem solving skills, ability to learn quickly, and attention to detail.
  • Good teamwork and oral and written communications skills are critical.

Nice To Haves

  • Experience with one or more interface protocols like HBM, LPDDR, DDR, GDDR, PCIe, Ethernet, USB, DisplayPort, HDMI, MIPI etc. is preferred.
  • Python and/or Perl programming desirable.
  • Familiar with UNIX environment.
  • Laboratory experience, including hands-on use of equipment: BERT, oscilloscope, logic analyzer, etc. desirable.

Responsibilities

  • Serve as the AMD technical owner for selected third-party Memory/Serdes PHY and mixed-signal IP across multiple product programs.
  • Provide technical leadership for the IP/PHY throughout the product lifecycle, from architecture --> integration --> post-silicon validation --> production.
  • Collaborate directly with third-party IP vendors to support IP evaluation, design transfer, release collateral, and integration into AMD SoCs; working closely with the Technical Project Manager.
  • Partner with SoC integration teams to ensure electrical, logical, and physical quality of IP integration.
  • Drive system-level architectural decisions by balancing performance, power, area, cost, and implementation constraints.
  • Interpret industry standards and customer requirements, translating them into silicon, package, PCB, and validation specifications.
  • Support package and PCB design teams with signal integrity and power integrity analysis, debug, and optimization; Partnering with SI/PI experts within AMD.
  • Evaluate new PHY and mixed-signal IP technologies for licensing and adoption.
  • Partner with post-silicon validation teams in directing first-silicon bring-up, debug, characterization, compliance testing, ATE production test support, and customer issue resolution.
  • Analyze post-silicon results and drive improvements to future PHY architectures, design methodologies, and IP development processes.
  • Provide technical guidance across the hardware development lifecycle, leveraging understanding of transistor-level design, system architecture, and SoC integration.

Benefits

  • AMD benefits at a glance.
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