Siemens EDA is seeking an experienced, motivated solution engineer for power, EMIR (electromigration and IR-drop), and reliability in its 3D IC Solutions Engineering team. The role develops end-to-end workflow solutions for advanced 2.5D and 3D System-in-Package designs, integrating Siemens EDA and simulation tools for architectural planning, physical design and verification, and multi-die electrical and thermomechanical analysis. The position defines and drives workflows for power, EMIR, and reliability analysis of 2.5D/3D IC package designs. Acting as a technical product owner, the engineer works with software engineering teams to turn roadmap priorities and customer needs into software deliverables. This includes using generative AI to create proof-of-concept demonstrators that help clarify requirements and user experience before formal development. Workflows support predictive analysis during architectural planning, in-design analysis during physical design, and signoff-to-manufacturing handoff analysis. Reference designs, test structures, and/or customer designs are used to develop, test, and validate workflows. The engineer also provides technical support to sales, marketing, and design services, and represents Siemens EDA in customer engagements. The role may involve creating technical marketing materials such as papers, demonstrations, and videos. Periodic travel may be required to work with customers.
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Job Type
Full-time
Career Level
Senior