The intern will have an exciting opportunity to develop chemical mechanical polish wafer process for recording head fabrication in a wafer process development team at our R&D site in Bloomington, MN. You will participate in CMP (chemical mechanical polish) process development in a development environment, under the supervision of one or more engineers. Projects may include developing CMP processes, collecting/analyzing data and presenting the results to the engineering community. You will acquire hands-on key skills to CMP process development that are applicable to both hard drive and semiconductor industries. Working in a team environment, you will be exposed to senior engineers and will have the opportunity to share your knowledge and learn from them.
Stand Out From the Crowd
Upload your resume and get instant feedback on how well it matches this job.
Career Level
Intern
Industry
Computer and Electronic Product Manufacturing
Number of Employees
5,001-10,000 employees