Thin Film Operator

CAES•San Jose, CA

50d•$25 - $29

About The Position

Delivering mission-critical, electronic solutions that protect lives. Use your creativity and critical thinking to take our products from concept to customer. At CAES by Honeywell, we engineer solutions for the world's most critical missions. We serve customers in the defense and aerospace markets. Seeking a career that offers challenging, diverse projects and opportunities? Looking for a position with a company that offers long-term professional advancement? Searching for a place that values a diverse, team-based environment? One that values YOU. Consider CAES. The most important thing we build is TRUST Overview The Thin Film Operator will perform multiple operations including but not limited to photolithography, cleaning, laser drilling, and kitting of substrates. The role includes the use of machines, wet benches, microscopes, and hand tools to perform operations.

Requirements

High school Diploma/GED
Ability to work the day shift position (5:00 am to 1:30 pm).
3 (three) plus years of manufacturing-related experience.
This position requires access to technology, materials, software or hardware that is controlled by US export laws. In order to be eligible for this position, you must be a "US Person" under US export laws (or eligible for approval under a U.S. Government export license).

Nice To Haves

Experience in thin film or wafer manufacturing.
Experience using microscopes and hand tools such as knives or tweezers.
Must have good written and verbal communication skills.
Must be able to work independently and be self-motivated.
Must be able to work in a team environment and participate in problem solving when process and quality issues come up.

Responsibilities

Perform photolithography steps, including spray coating, aligning, and operating wet benches to clean, develop, and etch Thin Film wafers.
Perform cleaning and deburring of Thin Film substrates. Deburring includes using sandpaper, brushes, and hand tools to clean substrate surfaces and edges.
Perform laser drilling of substrates.
Perform kitting of substrates using vacuum wands and tweezers.
Perform other tasks based on supervisor request.
Inspections and certain steps are performed under a microscope.
Maintain logs, fill out operation sheets, and input data into databases.
Understand and follow assembly drawings, written, and verbal work instructions.
Do basic math and apply it to specifications.
Identify and communicate when substrates and processes do not meet specifications