Test Module Development Engineer

Intel Corporation • Chandler, AZ

4d • Onsite

About The Position

Intel's Advanced Packaging Technology Manufacturing (APTM) group is a critical division driving the next generation of semiconductor packaging solutions. The team focuses on groundbreaking technologies that extend beyond traditional methods to enable the future of high-performance computing. Primary Focus: • Advanced semiconductor packaging technologies beyond conventional approaches • 3D packaging innovations and chiplet integration • High‑performance computing packaging for data centers and AI applications • Heterogeneous integration across diverse chip technologies • Scaling packaging density while enhancing thermal and electrical performance Key Objectives: • Advance Moore's Law through cutting‑edge packaging technologies • Reduce system‑level power consumption while improving overall performance • Support Intel's IDM 2.0 strategy and Intel Foundry Services • Develop packaging solutions tailored to emerging workloads such as AI and edge computing Test Module Development Engineer responsibilities include but are not limited to: • Executes test technology development and enablement for high‑mix, low‑volume testing and future technologies, provides process integration and equipment solutions, and performs feasibility studies to meet desired device specifications. • Implements design and development of technically sophisticated test processes and/or repair reverse engineering, including material selection, parameter optimization, equipment metrology, and system design to enable new product designs and functional requirements. • Executes pathfinding and development activities in support of the Intel Foundry advanced packaging roadmap. • Implements modifications for test equipment/collateral to improve efficiency, manufacturing techniques, and optimize production output for existing products. • Partners with key equipment and materials suppliers to develop and implement enabling elements of the technology. • Executes technology feasibility studies through theoretical simulations and/or practical engineering methods. • Remains updated on relevant industrial process and materials manufacturing trends and develops a perspective on the Intel Foundry Advanced Packaging roadmap to drive industry leadership by collaborating with vendor ecosystems for cost‑effective solutions. Behavioral traits: • Excellent verbal and written communication skills. • Initiative, self-motivated and ability to work independently. This position requires regular onsite presence.

Requirements

• Bachelor's degree in engineering, physics, chemistry or related STEM field with 6+ years of experience. OR
• Master's degree in engineering, physics, chemistry or related STEM field with 4+ years of experience. OR
• Ph.D. degree in engineering, physics, chemistry or related field.
• The experience outlined above should reflect a combination of the following competencies:
• Electrical test–related experience
• Application of statistical controls
• FMEA and/or DOE methodologies
• Excellent verbal and written communication skills.
• Initiative, self-motivated and ability to work independently.
• This position requires regular onsite presence.

Nice To Haves

• Prior related work experience with semiconductor package design, test software, and/or test equipment/collateral/fixture development.
• Product ownership, change control management and data systems
• Project management and delivering results for time-critical technical projects.
• Technical innovation and deliver results for complex, time-critical technical projects.

Responsibilities

• Executes test technology development and enablement for high‑mix, low‑volume testing and future technologies, provides process integration and equipment solutions, and performs feasibility studies to meet desired device specifications.
• Implements design and development of technically sophisticated test processes and/or repair reverse engineering, including material selection, parameter optimization, equipment metrology, and system design to enable new product designs and functional requirements.
• Executes pathfinding and development activities in support of the Intel Foundry advanced packaging roadmap.
• Implements modifications for test equipment/collateral to improve efficiency, manufacturing techniques, and optimize production output for existing products.
• Partners with key equipment and materials suppliers to develop and implement enabling elements of the technology.
• Executes technology feasibility studies through theoretical simulations and/or practical engineering methods.
• Remains updated on relevant industrial process and materials manufacturing trends and develops a perspective on the Intel Foundry Advanced Packaging roadmap to drive industry leadership by collaborating with vendor ecosystems for cost‑effective solutions.

Benefits

• We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation.
• Find out more about the benefits of working at Intel.

What This Job Offers

• Job Type: Full-time
• Career Level: Mid Level
• Education Level: Ph.D. or professional degree