System Fault Isolation Intern, Operations - Summer 2026

NVIDIA • Us, CA

14d • $20 - $71

About The Position

Welcome to the world of NVIDIA, where innovation knows no bounds. We've been at the forefront of technology for over two decades, and our groundbreaking invention of the GPU in 1999 revolutionized not only an industry but also the very way we engage with computers, robots, and autonomous vehicles. Today, NVIDIA stands at the forefront of AI computing and is committed to continue pushing the limits of what is achievable. Join us on this remarkable journey as we shape the future every day. Today, visual computing is becoming increasingly central to how people interact with technology, and there has never been a more exciting time to join our team! We need a System Fault Isolation Intern with expertise in physics, process and package technologies, and circuit design to debug complex product failures. This individual will work within our Failure Analysis Lab that performs Electrical Failure Analysis (EFA) and Physical Failure Analysis (PFA) on the world’s most advanced semiconductor products and systems. This unique role requires someone who thrives in a fast-paced, highly dynamic environment that can adapt to a variety of challenges. What you'll be doing: Gain experience in debugging product failures at the die, package, component, and board level Develop a working understanding of EFA and PFA techniques and tools including curve tracing, Electro-Optical Terahertz Pulse Reflectometry (EOTPR), Vector Network Analyzer (VNA), Scanning Acoustic Microscopy (SAM), X-ray Computed Tomography (CT), Laser Voltage Probing (LVP), Optical/Electron/Atomic Force Microscopy, and Ultra-thinning/delayering and cross sectioning sample preparation techniques Build knowledge surrounding the interactions between process technology, physical design, and circuit design Develop innovations to help enhance the capability and efficiency of FA processes

Requirements

• Pursuing a Bachelors or Masters degree in Electrical/Computer Engineering, Chemical Engineering, Materials Science/Engineering, Physics, or other related field
• Lab experience with electrical and materials characterization tools
• Experience in one or more areas across silicon process technology, VLSI design, and FA tools such as Curve Tracer, SEM, Lock-in Thermography, Pulse Reflectometry, LVP, etc.
• Excellent communication skills and teamwork both cross-functionally and between companies

Nice To Haves

• Practical experience in silicon technology and/or design
• In-depth understanding of IC fabrication processes, electronic circuit analysis, and semiconductor physics
• Hands-on experience with FA related analytical tools
• Ability to build, train, and maintain AI models
• Experience working with global teams

Responsibilities

• Gain experience in debugging product failures at the die, package, component, and board level
• Develop a working understanding of EFA and PFA techniques and tools including curve tracing, Electro-Optical Terahertz Pulse Reflectometry (EOTPR), Vector Network Analyzer (VNA), Scanning Acoustic Microscopy (SAM), X-ray Computed Tomography (CT), Laser Voltage Probing (LVP), Optical/Electron/Atomic Force Microscopy, and Ultra-thinning/delayering and cross sectioning sample preparation techniques
• Build knowledge surrounding the interactions between process technology, physical design, and circuit design
• Develop innovations to help enhance the capability and efficiency of FA processes

What This Job Offers

• Career Level: Intern
• Number of Employees: 5,001-10,000 employees