Staff Signal Integrity & Power Integrity Engineer (SI/PI)
About The Position
Cerebras Systems builds the world's largest AI chip, 56 times larger than GPUs. Our novel wafer-scale architecture provides the AI compute power of dozens of GPUs on a single chip, with the programming simplicity of a single device. This approach allows Cerebras to deliver industry-leading training and inference speeds and empowers machine learning users to effortlessly run large-scale ML applications, without the hassle of managing hundreds of GPUs or TPUs. Cerebras' current customers include top model labs, global enterprises, and cutting-edge AI-native startups. OpenAI recently announced a multi-year partnership with Cerebras , to deploy 750 megawatts of scale, transforming key workloads with ultra high-speed inference. Thanks to the groundbreaking wafer-scale architecture, Cerebras Inference offers the fastest Generative AI inference solution in the world, over 10 times faster than GPU-based hyperscale cloud inference services. This order of magnitude increase in speed is transforming the user experience of AI applications, unlocking real-time iteration and increasing intelligence via additional agentic computation. Job Summary We are seeking a Principal Signal Integrity and Power Integrity Engineer to solve complex, high‑impact integrity challenges in next‑generation AI compute systems. This role is focused on deep technical analysis and hands‑on problem solving across high‑speed interfaces, power delivery networks, rigid and flex interconnects, and advanced packaging. The ideal candidate is a technical expert engaged to resolve difficult SI/PI problems spanning silicon, package, PCB, flex, and connector domains.
Requirements
- Master’s degree in Electrical Engineering.
- 15+ years of demonstrated depth of expertise in signal integrity and power integrity engineering for high‑speed hardware systems.
- Deep expertise in high‑speed serial and parallel interface analysis and debug.
- Strong hands‑on experience with PCB, rigid‑flex, and flex circuit stack‑up design and analysis.
- Advanced SI/PI analysis of flex connectors, high‑density interconnects, and advanced packaging technologies.
- Proficiency with 2D and 3D electromagnetic simulation tools.
- Power delivery network analysis, simulation, and lab correlation at the system level.
- Strong grounding in transmission line theory, microwave engineering, and high‑speed design fundamentals.
- Proven ability to correlate simulation results with hardware behavior and drive concrete design fixes.
Nice To Haves
- Experience with large‑scale AI or high‑performance compute systems is preferred.
Responsibilities
- Solve complex signal integrity and power integrity problems for high‑speed AI compute platforms, including chip‑to‑chip and chip‑to‑board interfaces.
- Perform advanced pre‑layout and post‑layout SI/PI analysis across PCBs, flex circuits, rigid‑flex assemblies, connectors, and advanced packages.
- Lead root‑cause analysis of challenging SI/PI issues such as margin shortfalls, impedance discontinuities, coupling, resonances, and simulation‑to‑hardware mismatches.
- Analyze and resolve SI/PI challenges associated with flex circuits, high‑speed flex connectors, interposers, and advanced packaging technologies.
- Analyze and troubleshoot power delivery networks using DC and AC simulations and hardware correlation to resolve performance and stability issues.
- Define and refine PCB, rigid‑flex, and flex circuit stack‑ups, material selections, and impedance structures as required to meet performance targets.
- Review schematics, PCB layouts, and flex designs to identify SI/PI risks and recommend targeted design changes.
- Work closely with silicon and package design teams to resolve SI/PI issues related to bump/ball assignments, package‑to‑PCB transitions, and interface interactions.
- Act as a technical escalation point for complex SI/PI issues across multiple programs.
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What This Job Offers
Job Type
Full-time
Career Level
Mid Level
Number of Employees
251-500 employees
