Principal Signal & Power Integrity Engineer
About The Position
MaxLinear is seeking a Principal Signal & Power Integrity (SI/PI) Engineer to join our team. In this role, you will focus on the following: Development of state-of-the-art packages and printed circuit boards (PCBs) for MaxLinear’s next generation products Perform SI/PI simulations and optimization to ensure critical signals meet their required specifications Design and simulate high-speed signal interfaces and power distribution networks (PDN) for advanced communications SoC packages and PCBs Work on a diverse set of products and applications including RF/mm-wave modems and transceivers, 5G communication, wireless connectivity, and optical communications (PAM4 1.6T/3.2T DSPs and TIAs) for data center connectivity and storage for AI applications
Requirements
- Deep understanding of Electromagnetic fundamentals, transmission lines, and microwave theory
- Experience designing and simulating signal and power integrity solutions for high-speed system components (packages, PCB, connectors)
- Experience with high-speed channel simulations for SerDes and transient simulations for SI and PI
- Understanding of S-parameters, Smith Chart, and frequency domain analysis
- Proficiency in use of 2.5D and 3D simulation tools such as ANSYS HFSS, SIwave, Cadence Sigrity tools, or similar field solvers
- Expertise in time and frequency domain analysis using simulation tools like ADS, SPECTRE, etc.
- Hands-on experience with lab measurement equipment like Spectrum Analyzer, Vector Network Analyzer (VNA), Oscilloscopes, TDR
- Ability to manage package development in collaboration with cross functional teams including systems, IC design, IC physical layout, package/PCB layout, and test/characterization teams
- Self-motivated with ability to work effectively in both independent and team settings
- Strong communication, presentation, and documentation skills
- Excellent problem-solving skills and ability to excel in a fast-paced environment
- BS in Electrical Engineering or related + 9 years of experience, or MS + 7 years of experience, or Ph.D. + 4 years of experience
Nice To Haves
- Experience with layout tools such as Cadence Allegro and APD
- Understanding of different IEEE and Optical standards to define design guidelines
- Experience with electro-optic integration on packages; co-packaging of DC-DC convertors, regulator, TIAs, and optical drivers and multi-chip package design
- Familiarity with IC design flows, floor-planning, IO ring design, on-chip decoupling, on-die EM/IR analysis
- Understanding of different TX/RX circuit designs and how system SI/PI impacts such circuits. Use this knowledge to drive the design of packages and PCBs
- Expertise in equalization techniques such as FIR, CTLE, DFE, FFE and different types of noise in the system and channels and how to optimize EQ settings to mitigate them
Responsibilities
- Development of state-of-the-art packages and printed circuit boards (PCBs) for MaxLinear’s next generation products
- Perform SI/PI simulations and optimization to ensure critical signals meet their required specifications
- Design and simulate high-speed signal interfaces and power distribution networks (PDN) for advanced communications SoC packages and PCBs
- Work on a diverse set of products and applications including RF/mm-wave modems and transceivers, 5G communication, wireless connectivity, and optical communications (PAM4 1.6T/3.2T DSPs and TIAs) for data center connectivity and storage for AI applications
Benefits
- health care benefits
- 401k savings plan
- Employee Stock Purchase Plan (ESPP)
- paid time off
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What This Job Offers
Job Type
Full-time
Career Level
Mid Level
Number of Employees
501-1,000 employees
