Supports customer product enablement and ecosystem adoption of Intel products and solutions. May include assisting customer system integration, validation, and issue resolution as well as creation of technical collateral, customer training, and lifecycle management activities. May also collaborate with internal teams and external partners to ensure platform readiness, smooth product ramps, and support ecosystem enablement for platform solution readiness. As an intern, learns and applies knowledge, builds skills, and explores future career opportunities through hands on experience and projects that support Intel business goals in a collaborative environment. Signal integrity intern in Advanced Packaging Technology and Manufacturing (APTM) organization supporting electrical and optical high speed IO (HSIO) and signal integrity related package technology development, package design, and methodology development. Specific responsibilities include: • Development of necessary electrical/optical methodology and metrology core competencies needed for package technology development, design and automation. • Conduct necessary electrical/optical extraction, analysis, and optimization of the high-speed interfaces to assure package designs meet performance specifications for signaling performance. • Collaborate with other engineers in the team and help establish a positive team atmosphere promoting growth. Qualifications: Candidate must possess the below minimum qualifications to be considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Experience listed below would be obtained through a combination of schoolwork/classes/research and/or relevant previous job and/or internship experiences.
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Career Level
Intern
Number of Employees
5,001-10,000 employees