As a Senior Advanced Package Technologist, you will serve as the primary technical bridge between our strategic customers and our internal engineering teams. Rather than focusing on hands-on process development, you will lead technical strategy to define the future of Datacenter SoC packaging. You will be responsible for interpreting complex customer requirements, driving the technical roadmap for advanced packaging (2.5D/3D) and Chiplet architectures, and ensuring that our solutions align with the performance demands of next-generation AI and HPC infrastructure. Location: Daily onsite presence at our San Jose headquarters in alignment with our Flexible Work policy. Reports to: Head of Custom SoC Solutions Team Req: 42813
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Job Type
Full-time
Career Level
Mid Level
Number of Employees
5,001-10,000 employees