Senior Staff Engineer, Advanced Package Technology Development & Design

Marvell • Westlake Village, CA

42d

About The Position

Marvell's semiconductor solutions are the essential building blocks of the data infrastructure that connects our world. Across enterprise, cloud and AI, and carrier architectures, our innovative technology is enabling new possibilities. At Marvell, you can affect the arc of individual lives, lift the trajectory of entire industries, and fuel the transformative potential of tomorrow. For those looking to make their mark on purposeful and enduring innovation, above and beyond fleeting trends, Marvell is a place to thrive, learn, and lead. The Marvell Advanced Packaging team is responsible for package design and technology development to meet the electrical, mechanical, thermal and system requirements for the next generation high performance computing (HPC), Artificial Intelligence (AI) and networking solutions. The group focuses on signal integrity, power integrity, thermal integrity, mechanical integrity, high speed signaling and complex power delivery networks (PDNs) requiring innovative and custom solutions to meet constantly evolving customer needs. Many of the new designs require multi-chip, multiple component configurations involving, but not limited to, 2.5D and 3D packages, Co-packaged copper or optics and advanced substrates. Marvell has partnered with the world's leading manufacturers to solve our customer's most challenging designs and integrations with industry-leading packaging technologies

Requirements

• Bachelor's degree in Electrical Engineering or related fields and 5-10 years of related professional experience, or Master's degree and/or PhD in Computer Science, Electrical Engineering or related fields with 3-5 years of experience.
• Working knowledge of SI/PI principles and simulation tools (e.g., Ansys HFSS, Cadence Sigrity, Keysight ADS).
• Familiarity with substrate design, packaging materials, and assembly processes.
• Basic understanding of circuit extraction and simulation workflows.
• Hands-on experience with packaging co-design and electrical modeling.
• Familiarity with high-speed interfaces and power delivery networks.
• Exposure to optoelectronic packaging or interest in learning about photonic integration.
• Strong communication and collaboration skills.

Responsibilities

• Support the development of advanced packaging solutions, including 2.5D architectures (e.g., CoWoS, EMIB, CPO, CPC).
• Perform SI/PI simulations under the guidance of senior engineers using industry-standard EDA tools.
• Assist in evaluating package and PCB designs to meet electrical performance targets.
• Collaborate with physical design and IP teams to support electrical optimization.
• Contribute to optoelectronic packaging efforts, including photonic component integration and co-design with electrical interconnects.
• Document analysis results and present findings to internal teams.
• Participate in cross-functional meetings and design reviews.
• Take ownership of assigned tasks and follow through to completion, adjusting approach as needed to meet goals.

Benefits

• At Marvell, we offer a total compensation package with a base, bonus and equity.
• Health and financial wellbeing are part of the package.
• That means flexible time off, 401k, plus a year-end shutdown, floating holidays, paid time off to volunteer.

What This Job Offers

• Job Type: Full-time
• Career Level: Mid Level
• Industry: Computer and Electronic Product Manufacturing
• Number of Employees: 5,001-10,000 employees